Environmental influence on cracking and debonding of electrically conductive adhesives
Abstract
Electrically conductive adhesives (ECAs) are starting to replace metallic solders in recent designs of photovoltaic (PV) modules. This transition represents a significant material change, and a proper understanding of the durability and reliability of the new interconnect needs to be established. This paper presents our continued work on developing a degradation model for ECA interconnects in PV modules. Here, we characterize the fracture mechanics properties of an epoxy-based ECA, for both critical and subcritical, mode I and mode II loading conditions. Emphasis is on the influence of different environmental conditions such as temperature and humidity. We use the Finite Element Method to account for residual stresses, induced by temperature changes and moisture absorption, and correct the apparent fracture toughness. We found that high moisture levels not only can weaken the fracture resistance of the ECA interconnect, but can also promote subcritical debonding at significantly lower driving forces than in dry environments.
- Publication Date:
- Research Org.:
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE), Renewable Power Office. Solar Energy Technologies Office
- OSTI Identifier:
- 1726036
- Alternate Identifier(s):
- OSTI ID: 1809265
- Report Number(s):
- NREL/JA-5K00-78264
Journal ID: ISSN 0013-7944; MainId:32181;UUID:137e5713-f3af-4356-b312-3f4bc74a1b31;MainAdminID:18839
- Grant/Contract Number:
- AC36-08GO28308
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Engineering Fracture Mechanics
- Additional Journal Information:
- Journal Volume: 241; Journal ID: ISSN 0013-7944
- Publisher:
- Elsevier
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; electrically conductive adhesives; fracture properties; subcritical debonding; mode I; mode II; photovoltaics
Citation Formats
Springer, Martin, and Bosco, N. Environmental influence on cracking and debonding of electrically conductive adhesives. United States: N. p., 2020.
Web. doi:10.1016/j.engfracmech.2020.107398.
Springer, Martin, & Bosco, N. Environmental influence on cracking and debonding of electrically conductive adhesives. United States. https://doi.org/10.1016/j.engfracmech.2020.107398
Springer, Martin, and Bosco, N. Wed .
"Environmental influence on cracking and debonding of electrically conductive adhesives". United States. https://doi.org/10.1016/j.engfracmech.2020.107398. https://www.osti.gov/servlets/purl/1726036.
@article{osti_1726036,
title = {Environmental influence on cracking and debonding of electrically conductive adhesives},
author = {Springer, Martin and Bosco, N.},
abstractNote = {Electrically conductive adhesives (ECAs) are starting to replace metallic solders in recent designs of photovoltaic (PV) modules. This transition represents a significant material change, and a proper understanding of the durability and reliability of the new interconnect needs to be established. This paper presents our continued work on developing a degradation model for ECA interconnects in PV modules. Here, we characterize the fracture mechanics properties of an epoxy-based ECA, for both critical and subcritical, mode I and mode II loading conditions. Emphasis is on the influence of different environmental conditions such as temperature and humidity. We use the Finite Element Method to account for residual stresses, induced by temperature changes and moisture absorption, and correct the apparent fracture toughness. We found that high moisture levels not only can weaken the fracture resistance of the ECA interconnect, but can also promote subcritical debonding at significantly lower driving forces than in dry environments.},
doi = {10.1016/j.engfracmech.2020.107398},
journal = {Engineering Fracture Mechanics},
number = ,
volume = 241,
place = {United States},
year = {Wed Nov 11 00:00:00 EST 2020},
month = {Wed Nov 11 00:00:00 EST 2020}
}
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