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Title: High performance piezoresistive response of nanostructured ZnO/Ag thin films for pressure sensing applications

Authors:
ORCiD logo; ; ; ORCiD logo; ORCiD logo; ORCiD logo
Publication Date:
Sponsoring Org.:
USDOE Office of Nuclear Energy (NE), Nuclear Fuel Cycle and Supply Chain
OSTI Identifier:
1682499
Grant/Contract Number:  
PTDC/EEI-SII/5582/2014; SFRH/BPD/102402/2014; ANR-17-EURE-0002
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Thin Solid Films
Additional Journal Information:
Journal Name: Thin Solid Films Journal Volume: 691 Journal Issue: C; Journal ID: ISSN 0040-6090
Publisher:
Elsevier
Country of Publication:
Netherlands
Language:
English

Citation Formats

Ferreira, Armando, Silva, João Paulo, Rodrigues, Rui, Martin, Nicolas, Lanceros-Méndez, Senentxu, and Vaz, Filipe. High performance piezoresistive response of nanostructured ZnO/Ag thin films for pressure sensing applications. Netherlands: N. p., 2019. Web. https://doi.org/10.1016/j.tsf.2019.137587.
Ferreira, Armando, Silva, João Paulo, Rodrigues, Rui, Martin, Nicolas, Lanceros-Méndez, Senentxu, & Vaz, Filipe. High performance piezoresistive response of nanostructured ZnO/Ag thin films for pressure sensing applications. Netherlands. https://doi.org/10.1016/j.tsf.2019.137587
Ferreira, Armando, Silva, João Paulo, Rodrigues, Rui, Martin, Nicolas, Lanceros-Méndez, Senentxu, and Vaz, Filipe. Sun . "High performance piezoresistive response of nanostructured ZnO/Ag thin films for pressure sensing applications". Netherlands. https://doi.org/10.1016/j.tsf.2019.137587.
@article{osti_1682499,
title = {High performance piezoresistive response of nanostructured ZnO/Ag thin films for pressure sensing applications},
author = {Ferreira, Armando and Silva, João Paulo and Rodrigues, Rui and Martin, Nicolas and Lanceros-Méndez, Senentxu and Vaz, Filipe},
abstractNote = {},
doi = {10.1016/j.tsf.2019.137587},
journal = {Thin Solid Films},
number = C,
volume = 691,
place = {Netherlands},
year = {2019},
month = {12}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1016/j.tsf.2019.137587

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