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Title: Fidelity and Uhlmann connection analysis of topological phase transitions in two dimensions

Authors:
; ; ; ;
Publication Date:
Grant/Contract Number:
PD/BD/113651/2015; SFRH/BD/52244/2013; PD/BD/52652/2014; UID/CTM/04540/2013; PEst-OE/EEI/LA0008/2013; UID/EEA/50008/2013; PTDC/EEI-CTP/4503/2014
Type:
Publisher's Accepted Manuscript
Journal Name:
Physical Review B
Additional Journal Information:
Journal Name: Physical Review B Journal Volume: 98 Journal Issue: 24; Journal ID: ISSN 2469-9950
Publisher:
American Physical Society
Sponsoring Org:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Fuel Cell Technologies Office (EE-3F)
Country of Publication:
United States
Language:
English
OSTI Identifier:
1488886

Amin, Syed Tahir, Mera, Bruno, Vlachou, Chrysoula, Paunković, Nikola, and Vieira, Vítor R. Fidelity and Uhlmann connection analysis of topological phase transitions in two dimensions. United States: N. p., Web. doi:10.1103/PhysRevB.98.245141.
Amin, Syed Tahir, Mera, Bruno, Vlachou, Chrysoula, Paunković, Nikola, & Vieira, Vítor R. Fidelity and Uhlmann connection analysis of topological phase transitions in two dimensions. United States. doi:10.1103/PhysRevB.98.245141.
Amin, Syed Tahir, Mera, Bruno, Vlachou, Chrysoula, Paunković, Nikola, and Vieira, Vítor R. 2018. "Fidelity and Uhlmann connection analysis of topological phase transitions in two dimensions". United States. doi:10.1103/PhysRevB.98.245141.
@article{osti_1488886,
title = {Fidelity and Uhlmann connection analysis of topological phase transitions in two dimensions},
author = {Amin, Syed Tahir and Mera, Bruno and Vlachou, Chrysoula and Paunković, Nikola and Vieira, Vítor R.},
abstractNote = {},
doi = {10.1103/PhysRevB.98.245141},
journal = {Physical Review B},
number = 24,
volume = 98,
place = {United States},
year = {2018},
month = {12}
}

Works referenced in this record:

Topological Insulator Materials
journal, October 2013
  • Ando, Yoichi
  • Journal of the Physical Society of Japan, Vol. 82, Issue 10, Article No. 102001
  • DOI: 10.7566/JPSJ.82.102001