Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films
- Authors:
-
- Department of Applied Physics and Applied Mathematics, Columbia University, New York, New York 10027
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1420471
- Grant/Contract Number:
- SC0012704
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Journal of Vacuum Science and Technology A
- Additional Journal Information:
- Journal Name: Journal of Vacuum Science and Technology A Journal Volume: 35 Journal Issue: 6; Journal ID: ISSN 0734-2101
- Publisher:
- American Vacuum Society
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Barmak, Katayun, and Liu, Jiaxing. Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films. United States: N. p., 2017.
Web. doi:10.1116/1.5003628.
Barmak, Katayun, & Liu, Jiaxing. Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films. United States. https://doi.org/10.1116/1.5003628
Barmak, Katayun, and Liu, Jiaxing. Wed .
"Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films". United States. https://doi.org/10.1116/1.5003628.
@article{osti_1420471,
title = {Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films},
author = {Barmak, Katayun and Liu, Jiaxing},
abstractNote = {},
doi = {10.1116/1.5003628},
journal = {Journal of Vacuum Science and Technology A},
number = 6,
volume = 35,
place = {United States},
year = {Wed Nov 01 00:00:00 EDT 2017},
month = {Wed Nov 01 00:00:00 EDT 2017}
}
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https://doi.org/10.1116/1.5003628
https://doi.org/10.1116/1.5003628
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Cited by: 9 works
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