Monolith electroplating process
Abstract
An electroplating process for preparing a monolith metal layer over a polycrystalline base metal and the plated monolith product. A monolith layer has a variable thickness of one crystal. The process is typically carried in molten salts electrolytes, such as the halide salts under an inert atmosphere at an elevated temperature, and over deposition time periods and film thickness sufficient to sinter and recrystallize completely the nucleating metal particles into one single crystal or crystals having very large grains. In the process, a close-packed film of submicron particle (20) is formed on a suitable substrate at an elevated temperature. The temperature has the significance of annealing particles as they are formed, and substrates on which the particles can populate are desirable. As the packed bed thickens, the submicron particles develop necks (21) and as they merge into each other shrinkage (22) occurs. Then as micropores also close (23) by surface tension, metal density is reached and the film consists of unstable metal grain (24) that at high enough temperature recrystallize (25) and recrystallized grains grow into an annealed single crystal over the electroplating time span. While cadmium was used in the experimental work, other soft metals may be used.
- Inventors:
-
- 1410 S. Busse Rd., 2K, Mt. Prospect, IL 60056
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- OSTI Identifier:
- 873597
- Patent Number(s):
- 6200453
- Assignee:
- Agarrwal, Rajev R. (1410 S. Busse Rd., 2K, Mt. Prospect, IL 60056)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
- DOE Contract Number:
- W-31109-ENG-38
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- monolith; electroplating; process; preparing; metal; layer; polycrystalline; base; plated; product; variable; thickness; crystal; typically; carried; molten; salts; electrolytes; halide; inert; atmosphere; elevated; temperature; deposition; time; periods; film; sufficient; sinter; recrystallize; completely; nucleating; particles; single; crystals; grains; close-packed; submicron; particle; 20; formed; suitable; substrate; significance; annealing; substrates; populate; desirable; packed; bed; thickens; necks; 21; merge; shrinkage; 22; occurs; micropores; close; 23; surface; tension; density; reached; consists; unstable; grain; 24; 25; recrystallized; grow; annealed; span; cadmium; experimental; soft; metals; metal particle; thickness sufficient; packed bed; film thickness; metal particles; metal layer; elevated temperature; molten salt; time period; single crystal; inert atmosphere; base metal; surface tension; time periods; suitable substrate; halide salt; stable metal; soft metal; halide salts; variable thickness; electroplating process; plating process; /205/
Citation Formats
Agarrwal, Rajev R. Monolith electroplating process. United States: N. p., 2001.
Web.
Agarrwal, Rajev R. Monolith electroplating process. United States.
Agarrwal, Rajev R. Mon .
"Monolith electroplating process". United States. https://www.osti.gov/servlets/purl/873597.
@article{osti_873597,
title = {Monolith electroplating process},
author = {Agarrwal, Rajev R},
abstractNote = {An electroplating process for preparing a monolith metal layer over a polycrystalline base metal and the plated monolith product. A monolith layer has a variable thickness of one crystal. The process is typically carried in molten salts electrolytes, such as the halide salts under an inert atmosphere at an elevated temperature, and over deposition time periods and film thickness sufficient to sinter and recrystallize completely the nucleating metal particles into one single crystal or crystals having very large grains. In the process, a close-packed film of submicron particle (20) is formed on a suitable substrate at an elevated temperature. The temperature has the significance of annealing particles as they are formed, and substrates on which the particles can populate are desirable. As the packed bed thickens, the submicron particles develop necks (21) and as they merge into each other shrinkage (22) occurs. Then as micropores also close (23) by surface tension, metal density is reached and the film consists of unstable metal grain (24) that at high enough temperature recrystallize (25) and recrystallized grains grow into an annealed single crystal over the electroplating time span. While cadmium was used in the experimental work, other soft metals may be used.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 2001},
month = {Mon Jan 01 00:00:00 EST 2001}
}