Method of accurate thickness measurement of boron carbide coating on copper foil
Abstract
A method is disclosed of measuring the thickness of a thin coating on a substrate comprising dissolving the coating and substrate in a reagent and using the post-dissolution concentration of the coating in the reagent to calculate an effective thickness of the coating. The preferred method includes measuring non-conducting films on flexible and rough substrates, but other kinds of thin films can be measure by matching a reliable film-substrate dissolution technique. One preferred method includes determining the thickness of Boron Carbide films deposited on copper foil. The preferred method uses a standard technique known as inductively coupled plasma optical emission spectroscopy (ICPOES) to measure boron concentration in a liquid sample prepared by dissolving boron carbide films and the Copper substrates, preferably using a chemical etch known as ceric ammonium nitrate (CAN). Measured boron concentration values can then be calculated.
- Inventors:
- Issue Date:
- Research Org.:
- Proportional Technologies, Inc., Houston, TX (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1407708
- Patent Number(s):
- 9810635
- Application Number:
- 14/938,903
- Assignee:
- Proportional Technologies, Inc. (Houston, TX)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- DOE Contract Number:
- SC0009615
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Nov 12
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Lacy, Jeffrey L., and Regmi, Murari. Method of accurate thickness measurement of boron carbide coating on copper foil. United States: N. p., 2017.
Web.
Lacy, Jeffrey L., & Regmi, Murari. Method of accurate thickness measurement of boron carbide coating on copper foil. United States.
Lacy, Jeffrey L., and Regmi, Murari. Tue .
"Method of accurate thickness measurement of boron carbide coating on copper foil". United States. https://www.osti.gov/servlets/purl/1407708.
@article{osti_1407708,
title = {Method of accurate thickness measurement of boron carbide coating on copper foil},
author = {Lacy, Jeffrey L. and Regmi, Murari},
abstractNote = {A method is disclosed of measuring the thickness of a thin coating on a substrate comprising dissolving the coating and substrate in a reagent and using the post-dissolution concentration of the coating in the reagent to calculate an effective thickness of the coating. The preferred method includes measuring non-conducting films on flexible and rough substrates, but other kinds of thin films can be measure by matching a reliable film-substrate dissolution technique. One preferred method includes determining the thickness of Boron Carbide films deposited on copper foil. The preferred method uses a standard technique known as inductively coupled plasma optical emission spectroscopy (ICPOES) to measure boron concentration in a liquid sample prepared by dissolving boron carbide films and the Copper substrates, preferably using a chemical etch known as ceric ammonium nitrate (CAN). Measured boron concentration values can then be calculated.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 07 00:00:00 EST 2017},
month = {Tue Nov 07 00:00:00 EST 2017}
}
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