Composition and method for removing photoresist materials from electronic components
Abstract
Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.
- Inventors:
-
- Santa Fe, NM
- Los Alamos, NM
- Jemez Springs, NM
- Issue Date:
- Research Org.:
- Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 936715
- Patent Number(s):
- 7381694
- Application Number:
- 11/034,519
- Assignee:
- Los Alamos National Security, LLC (Los Alamos, NM)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C11 - ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES C11D - DETERGENT COMPOSITIONS
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
- DOE Contract Number:
- W-7405-ENG-36
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Davenhall, Leisa B, Rubin, James B, and Taylor, Craig M. V. Composition and method for removing photoresist materials from electronic components. United States: N. p., 2008.
Web.
Davenhall, Leisa B, Rubin, James B, & Taylor, Craig M. V. Composition and method for removing photoresist materials from electronic components. United States.
Davenhall, Leisa B, Rubin, James B, and Taylor, Craig M. V. Tue .
"Composition and method for removing photoresist materials from electronic components". United States. https://www.osti.gov/servlets/purl/936715.
@article{osti_936715,
title = {Composition and method for removing photoresist materials from electronic components},
author = {Davenhall, Leisa B and Rubin, James B and Taylor, Craig M. V.},
abstractNote = {Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2008},
month = {6}
}