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Title: Composition and method for removing photoresist materials from electronic components

Abstract

Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.

Inventors:
 [1];  [2];  [3]
  1. Santa Fe, NM
  2. Los Alamos, NM
  3. Jemez Springs, NM
Issue Date:
Research Org.:
Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
936715
Patent Number(s):
7381694
Application Number:
11/034,519
Assignee:
Los Alamos National Security, LLC (Los Alamos, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B08 - CLEANING B08B - CLEANING IN GENERAL
C - CHEMISTRY C11 - ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES C11D - DETERGENT COMPOSITIONS
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Davenhall, Leisa B, Rubin, James B, and Taylor, Craig M. V. Composition and method for removing photoresist materials from electronic components. United States: N. p., 2008. Web.
Davenhall, Leisa B, Rubin, James B, & Taylor, Craig M. V. Composition and method for removing photoresist materials from electronic components. United States.
Davenhall, Leisa B, Rubin, James B, and Taylor, Craig M. V. Tue . "Composition and method for removing photoresist materials from electronic components". United States. https://www.osti.gov/servlets/purl/936715.
@article{osti_936715,
title = {Composition and method for removing photoresist materials from electronic components},
author = {Davenhall, Leisa B and Rubin, James B and Taylor, Craig M. V.},
abstractNote = {Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 03 00:00:00 EDT 2008},
month = {Tue Jun 03 00:00:00 EDT 2008}
}