Composition and method for removing photoresist materials from electronic components
Patent
·
OSTI ID:1175216
Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.
- Research Organization:
- Univ. of California, Oakland, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- W-7405-ENG-36
- Assignee:
- The Regents of the University of California (Los Alamos, NM)
- Patent Number(s):
- 6,846,789
- Application Number:
- 10/133,709
- OSTI ID:
- 1175216
- Country of Publication:
- United States
- Language:
- English
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