Composition and method for removing photoresist materials from electronic components
Abstract
Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of California, Oakland, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175216
- Patent Number(s):
- 6846789
- Application Number:
- 10/133,709
- Assignee:
- The Regents of the University of California (Los Alamos, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B08 - CLEANING B08B - CLEANING IN GENERAL
C - CHEMISTRY C11 - ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES C11D - DETERGENT COMPOSITIONS
- DOE Contract Number:
- W-7405-ENG-36
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Davenhall, Leisa B., Rubin, James B., and Taylor, Craig M. Composition and method for removing photoresist materials from electronic components. United States: N. p., 2005.
Web.
Davenhall, Leisa B., Rubin, James B., & Taylor, Craig M. Composition and method for removing photoresist materials from electronic components. United States.
Davenhall, Leisa B., Rubin, James B., and Taylor, Craig M. Tue .
"Composition and method for removing photoresist materials from electronic components". United States. https://www.osti.gov/servlets/purl/1175216.
@article{osti_1175216,
title = {Composition and method for removing photoresist materials from electronic components},
author = {Davenhall, Leisa B. and Rubin, James B. and Taylor, Craig M.},
abstractNote = {Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {1}
}