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Title: Method and apparatus for component separation using microwave energy

Abstract

A method for separating and recovering components includes the steps of providing at least a first component bonded to a second component by a microwave absorbent adhesive bonding material at a bonding area to form an assembly, the bonding material disposed between the components. Microwave energy is directly and selectively applied to the assembly so that substantially only the bonding material absorbs the microwave energy until the bonding material is at a debonding state. A separation force is applied while the bonding material is at the debonding state to permit disengaging and recovering the components. In addition, an apparatus for practicing the method includes holders for the components.

Inventors:
 [1];  [2];  [3]
  1. Kingston, TN
  2. Ten Mile, TN
  3. (Knoxville, TN)
Issue Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
OSTI Identifier:
873647
Patent Number(s):
6211499
Application Number:
09/306356
Assignee:
BWXT Y-12 L.L.C. (Oak Ridge, TN)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL B01J - CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; apparatus; component; separation; microwave; energy; separating; recovering; components; steps; providing; bonded; absorbent; adhesive; bonding; material; form; assembly; disposed; directly; selectively; applied; substantially; absorbs; debonding; force; permit; disengaging; addition; practicing; holders; adhesive bonding; microwave energy; material disposed; bonding material; wave energy; adhesive bond; /219/134/

Citation Formats

Morrow, Marvin S, Schechter, Donald E, and Calhoun, Jr., Clyde L. Method and apparatus for component separation using microwave energy. United States: N. p., 2001. Web.
Morrow, Marvin S, Schechter, Donald E, & Calhoun, Jr., Clyde L. Method and apparatus for component separation using microwave energy. United States.
Morrow, Marvin S, Schechter, Donald E, and Calhoun, Jr., Clyde L. Tue . "Method and apparatus for component separation using microwave energy". United States. https://www.osti.gov/servlets/purl/873647.
@article{osti_873647,
title = {Method and apparatus for component separation using microwave energy},
author = {Morrow, Marvin S and Schechter, Donald E and Calhoun, Jr., Clyde L.},
abstractNote = {A method for separating and recovering components includes the steps of providing at least a first component bonded to a second component by a microwave absorbent adhesive bonding material at a bonding area to form an assembly, the bonding material disposed between the components. Microwave energy is directly and selectively applied to the assembly so that substantially only the bonding material absorbs the microwave energy until the bonding material is at a debonding state. A separation force is applied while the bonding material is at the debonding state to permit disengaging and recovering the components. In addition, an apparatus for practicing the method includes holders for the components.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {4}
}

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