Soldering instrument safety improvements

Kosslow, William J; Giron, Ronald W

Title: Soldering instrument safety improvements

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Abstract

A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

Inventors:

Kosslow, William J ^[1]; Giron, Ronald W ^[2]

Jefferson Boro, PA
Delmont, PA

Issue Date:: 1996-01-01

OSTI Identifier:: 870449

Patent Number(s):: 5524809

Assignee:: United States of America as represented by United States (Washington, DC)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

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B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K3/0369 - {Couplings between the heating element housing and the bit or tip}

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Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: soldering; instrument; safety; improvements; safe; device; retractable; heat; shield; moved; position; solder; tip; exposed; operation; covered; preferably; biased; towards; locked; ease; equipped; vacuum; serve; guide; flow; gases; non-heatsinking; plastic; heat shield; biased towards; /228/219/

Citation Formats


                    Kosslow, William J, and Giron, Ronald W. Soldering instrument safety improvements.  United States: N. p., 1996. 
        Web.

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                    Kosslow, William J, & Giron, Ronald W. Soldering instrument safety improvements.  United States.

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                    Kosslow, William J, and Giron, Ronald W. Mon .  
        "Soldering instrument safety improvements".  United States.  https://www.osti.gov/servlets/purl/870449.

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@article{osti_870449,

  title        = {Soldering instrument safety improvements},

  author       = {Kosslow, William J and Giron, Ronald W},

  abstractNote = {A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1996},

  month        = {1}

}

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