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Title: Soldering instrument safety improvements

Abstract

A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

Inventors:
 [1];  [2]
  1. Jefferson Boro, PA
  2. Delmont, PA
Issue Date:
OSTI Identifier:
870449
Patent Number(s):
5524809
Assignee:
United States of America as represented by United States (Washington, DC)
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
soldering; instrument; safety; improvements; safe; device; retractable; heat; shield; moved; position; solder; tip; exposed; operation; covered; preferably; biased; towards; locked; ease; equipped; vacuum; serve; guide; flow; gases; non-heatsinking; plastic; heat shield; biased towards; /228/219/

Citation Formats

Kosslow, William J, and Giron, Ronald W. Soldering instrument safety improvements. United States: N. p., 1996. Web.
Kosslow, William J, & Giron, Ronald W. Soldering instrument safety improvements. United States.
Kosslow, William J, and Giron, Ronald W. Mon . "Soldering instrument safety improvements". United States. https://www.osti.gov/servlets/purl/870449.
@article{osti_870449,
title = {Soldering instrument safety improvements},
author = {Kosslow, William J and Giron, Ronald W},
abstractNote = {A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {1}
}

Patent:

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