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Title: Chemical deposition methods using supercritical fluid solutions

Abstract

A method for depositing a film of a desired material on a substrate comprises dissolving at least one reagent in a supercritical fluid comprising at least one solvent. Either the reagent is capable of reacting with or is a precursor of a compound capable of reacting with the solvent to form the desired product, or at least one additional reagent is included in the supercritical solution and is capable of reacting with or is a precursor of a compound capable of reacting with the first reagent or with a compound derived from the first reagent to form the desired material. The supercritical solution is expanded to produce a vapor or aerosol and a chemical reaction is induced in the vapor or aerosol so that a film of the desired material resulting from the chemical reaction is deposited on the substrate surface. In an alternate embodiment, the supercritical solution containing at least one reagent is expanded to produce a vapor or aerosol which is then mixed with a gas containing at least one additional reagent. A chemical reaction is induced in the resulting mixture so that a film of the desired material is deposited.

Inventors:
 [1];  [1]
  1. Boulder, CO
Issue Date:
Research Org.:
SIEVERS RESEARCH INC
OSTI Identifier:
867603
Patent Number(s):
4970093
Assignee:
University of Colorado Foundation (Boulder, CO)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B05 - SPRAYING OR ATOMISING IN GENERAL B05D - PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
DOE Contract Number:  
AC05-88ER80684
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
chemical; deposition; methods; supercritical; fluid; solutions; method; depositing; film; desired; material; substrate; comprises; dissolving; reagent; comprising; solvent; capable; reacting; precursor; compound; form; product; additional; included; solution; derived; expanded; produce; vapor; aerosol; reaction; induced; resulting; deposited; surface; alternate; embodiment; containing; mixed; gas; mixture; substrate comprises; chemical deposition; comprises dissolving; desired material; deposition methods; deposition method; resulting mixture; gas containing; supercritical fluid; solution containing; chemical reaction; substrate surface; alternate embodiment; desired product; fluid solution; supercritical solution; compound capable; fluid comprising; /427/

Citation Formats

Sievers, Robert E, and Hansen, Brian N. Chemical deposition methods using supercritical fluid solutions. United States: N. p., 1990. Web.
Sievers, Robert E, & Hansen, Brian N. Chemical deposition methods using supercritical fluid solutions. United States.
Sievers, Robert E, and Hansen, Brian N. Mon . "Chemical deposition methods using supercritical fluid solutions". United States. https://www.osti.gov/servlets/purl/867603.
@article{osti_867603,
title = {Chemical deposition methods using supercritical fluid solutions},
author = {Sievers, Robert E and Hansen, Brian N},
abstractNote = {A method for depositing a film of a desired material on a substrate comprises dissolving at least one reagent in a supercritical fluid comprising at least one solvent. Either the reagent is capable of reacting with or is a precursor of a compound capable of reacting with the solvent to form the desired product, or at least one additional reagent is included in the supercritical solution and is capable of reacting with or is a precursor of a compound capable of reacting with the first reagent or with a compound derived from the first reagent to form the desired material. The supercritical solution is expanded to produce a vapor or aerosol and a chemical reaction is induced in the vapor or aerosol so that a film of the desired material resulting from the chemical reaction is deposited on the substrate surface. In an alternate embodiment, the supercritical solution containing at least one reagent is expanded to produce a vapor or aerosol which is then mixed with a gas containing at least one additional reagent. A chemical reaction is induced in the resulting mixture so that a film of the desired material is deposited.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1990},
month = {1}
}