DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Test probe for surface mounted leadless chip carrier

Abstract

A test probe for a surface mounted leadless chip carrier is disclosed. The probed includes specially designed connector pins which allow size reductions in the probe. A thermoplastic housing provides spring action to ensure good mechanical and electrical contact between the pins and the contact strips of a leadless chip carrier. Other features include flexible wires molded into the housing and two different types of pins alternately placed in the housing. These features allow fabrication of a smaller and simpler test probe.

Inventors:
 [1];  [2]
  1. Raytown, MO
  2. Lenexa, KS
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
OSTI Identifier:
866978
Patent Number(s):
4833404
Application Number:
07/103,865
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Classifications (CPCs):
G - PHYSICS G01 - MEASURING G01R - MEASURING ELECTRIC VARIABLES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
DOE Contract Number:  
AC04-76DP00613
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
probe; surface; mounted; leadless; chip; carrier; disclosed; probed; specially; designed; connector; pins; allow; size; reductions; thermoplastic; housing; provides; spring; action; ensure; mechanical; electrical; contact; strips; features; flexible; wires; molded; types; alternately; placed; fabrication; simpler; surface mounted; specially designed; electrical contact; chip carrier; leadless chip; housing provides; mounted leadless; surface mount; plastic housing; /324/439/

Citation Formats

Meyer, Kerry L, and Topolewski, John. Test probe for surface mounted leadless chip carrier. United States: N. p., 1989. Web.
Meyer, Kerry L, & Topolewski, John. Test probe for surface mounted leadless chip carrier. United States.
Meyer, Kerry L, and Topolewski, John. Tue . "Test probe for surface mounted leadless chip carrier". United States. https://www.osti.gov/servlets/purl/866978.
@article{osti_866978,
title = {Test probe for surface mounted leadless chip carrier},
author = {Meyer, Kerry L and Topolewski, John},
abstractNote = {A test probe for a surface mounted leadless chip carrier is disclosed. The probed includes specially designed connector pins which allow size reductions in the probe. A thermoplastic housing provides spring action to ensure good mechanical and electrical contact between the pins and the contact strips of a leadless chip carrier. Other features include flexible wires molded into the housing and two different types of pins alternately placed in the housing. These features allow fabrication of a smaller and simpler test probe.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 23 00:00:00 EDT 1989},
month = {Tue May 23 00:00:00 EDT 1989}
}