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Title: Test probe for surface mounted leadless chip carrier

Abstract

A test probe for a surface mounted leadless chip carrier is disclosed. The probe includes specially designed connector pins which allow size reductions in the probe. A thermoplastic housing provides spring action to ensure good mechanical and electrical contact between the pins and the contact strips of a leadless chip carrier. Other features include flexible wires molded into the housing and two different types of pins alternately placed in the housing. These features allow fabrication of a smaller and simpler test probe. 1 fig.

Inventors:
;
Issue Date:
Research Org.:
Allied Corp., Kansas City, MO (USA). Bendix Kansas City Div.
OSTI Identifier:
6867816
Patent Number(s):
-US-A6103865
Assignee:
TIC; EDB-88-179049
DOE Contract Number:  
AC04-76DP00613
Resource Type:
Patent
Resource Relation:
Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; ELECTRIC PROBES; DESIGN; CONNECTORS; ELECTRICAL TESTING; ELECTRONIC CIRCUITS; INVENTIONS; PRINTED CIRCUITS; CONDUCTOR DEVICES; ELECTRICAL EQUIPMENT; EQUIPMENT; MATERIALS TESTING; NONDESTRUCTIVE TESTING; PROBES; TESTING 420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)

Citation Formats

Meyer, K.L., and Topolewski, J. Test probe for surface mounted leadless chip carrier. United States: N. p., 1987. Web.
Meyer, K.L., & Topolewski, J. Test probe for surface mounted leadless chip carrier. United States.
Meyer, K.L., and Topolewski, J. Fri . "Test probe for surface mounted leadless chip carrier". United States.
@article{osti_6867816,
title = {Test probe for surface mounted leadless chip carrier},
author = {Meyer, K.L. and Topolewski, J.},
abstractNote = {A test probe for a surface mounted leadless chip carrier is disclosed. The probe includes specially designed connector pins which allow size reductions in the probe. A thermoplastic housing provides spring action to ensure good mechanical and electrical contact between the pins and the contact strips of a leadless chip carrier. Other features include flexible wires molded into the housing and two different types of pins alternately placed in the housing. These features allow fabrication of a smaller and simpler test probe. 1 fig.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1987},
month = {10}
}