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Title: Silicon ball grid array chip carrier

Abstract

A ball-grid-array integrated circuit (IC) chip carrier formed from a silicon substrate is disclosed. The silicon ball-grid-array chip carrier is of particular use with ICs having peripheral bond pads which can be reconfigured to a ball-grid-array. The use of a semiconductor substrate such as silicon for forming the ball-grid-array chip carrier allows the chip carrier to be fabricated on an IC process line with, at least in part, standard IC processes. Additionally, the silicon chip carrier can include components such as transistors, resistors, capacitors, inductors and sensors to form a "smart" chip carrier which can provide added functionality and testability to one or more ICs mounted on the chip carrier. Types of functionality that can be provided on the "smart" chip carrier include boundary-scan cells, built-in test structures, signal conditioning circuitry, power conditioning circuitry, and a reconfiguration capability. The "smart" chip carrier can also be used to form specialized or application-specific ICs (ASICs) from conventional ICs. Types of sensors that can be included on the silicon ball-grid-array chip carrier include temperature sensors, pressure sensors, stress sensors, inertia or acceleration sensors, and/or chemical sensors. These sensors can be fabricated by IC processes and can include microelectromechanical (MEM) devices.

Inventors:
 [1];  [2];  [1]
  1. (Albuquerque, NM)
  2. (Greensboro, NC)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
872960
Patent Number(s):
6052287
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
silicon; ball; grid; array; chip; carrier; ball-grid-array; integrated; circuit; formed; substrate; disclosed; particular; ics; peripheral; bond; pads; reconfigured; semiconductor; forming; allows; fabricated; process; line; standard; processes; additionally; components; transistors; resistors; capacitors; inductors; sensors; form; smart; provide; added; functionality; testability; mounted; types; provided; boundary-scan; cells; built-in; structures; signal; conditioning; circuitry; power; reconfiguration; capability; specialized; application-specific; asics; conventional; included; temperature; pressure; stress; inertia; acceleration; chemical; microelectromechanical; devices; power conditioning; chemical sensors; chemical sensor; semiconductor substrate; silicon substrate; integrated circuit; pressure sensor; chip carrier; temperature sensor; temperature sensors; signal conditioning; bond pads; grid array; silicon ball; ball grid; acceleration sensor; /361/174/228/257/

Citation Formats

Palmer, David W., Gassman, Richard A., and Chu, Dahwey. Silicon ball grid array chip carrier. United States: N. p., 2000. Web.
Palmer, David W., Gassman, Richard A., & Chu, Dahwey. Silicon ball grid array chip carrier. United States.
Palmer, David W., Gassman, Richard A., and Chu, Dahwey. Sat . "Silicon ball grid array chip carrier". United States. https://www.osti.gov/servlets/purl/872960.
@article{osti_872960,
title = {Silicon ball grid array chip carrier},
author = {Palmer, David W. and Gassman, Richard A. and Chu, Dahwey},
abstractNote = {A ball-grid-array integrated circuit (IC) chip carrier formed from a silicon substrate is disclosed. The silicon ball-grid-array chip carrier is of particular use with ICs having peripheral bond pads which can be reconfigured to a ball-grid-array. The use of a semiconductor substrate such as silicon for forming the ball-grid-array chip carrier allows the chip carrier to be fabricated on an IC process line with, at least in part, standard IC processes. Additionally, the silicon chip carrier can include components such as transistors, resistors, capacitors, inductors and sensors to form a "smart" chip carrier which can provide added functionality and testability to one or more ICs mounted on the chip carrier. Types of functionality that can be provided on the "smart" chip carrier include boundary-scan cells, built-in test structures, signal conditioning circuitry, power conditioning circuitry, and a reconfiguration capability. The "smart" chip carrier can also be used to form specialized or application-specific ICs (ASICs) from conventional ICs. Types of sensors that can be included on the silicon ball-grid-array chip carrier include temperature sensors, pressure sensors, stress sensors, inertia or acceleration sensors, and/or chemical sensors. These sensors can be fabricated by IC processes and can include microelectromechanical (MEM) devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

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