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Title: Method for integrating microelectromechanical devices with electronic circuitry

Abstract

A method is disclosed for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry. 13 figs.

Inventors:
; ; ;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
672713
Patent Number(s):
5798283
Application Number:
PAN: 8-524,700
Assignee:
Sandia Corp., Albuquerque, NM (United States)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 25 Aug 1998
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; MICROELECTRONIC CIRCUITS; ENGINES; HYBRID SYSTEMS; FABRICATION; ENCAPSULATION

Citation Formats

Montague, S, Smith, J H, Sniegowski, J J, and McWhorter, P J. Method for integrating microelectromechanical devices with electronic circuitry. United States: N. p., 1998. Web.
Montague, S, Smith, J H, Sniegowski, J J, & McWhorter, P J. Method for integrating microelectromechanical devices with electronic circuitry. United States.
Montague, S, Smith, J H, Sniegowski, J J, and McWhorter, P J. Tue . "Method for integrating microelectromechanical devices with electronic circuitry". United States.
@article{osti_672713,
title = {Method for integrating microelectromechanical devices with electronic circuitry},
author = {Montague, S and Smith, J H and Sniegowski, J J and McWhorter, P J},
abstractNote = {A method is disclosed for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry. 13 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {8}
}