Method for integrating microelectromechanical devices with electronic circuitry

Title: Method for integrating microelectromechanical devices with electronic circuitry

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Abstract

A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.

Inventors:

Montague, Stephen ^[1]; Smith, James H. ^[1]; Sniegowski, Jeffry J. ^[1]; McWhorter, Paul J. ^[1]

(Albuquerque, NM)

Issue Date:: 1998-01-01

Research Org.:: SANDIA CORP

OSTI Identifier:: 871797

Patent Number(s):: 5798283

Assignee:: Sandia Corporation (Albuquerque, NM) SNL

DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: method; integrating; microelectromechanical; devices; electronic; circuitry; comprises; steps; forming; device; cavity; below; surface; substrate; encapsulating; prior; releasing; operation; fabrication; planarization; encapsulated; formation; allows; standard; processing; microelectromechanical devices; device surface; electronic circuit; method comprises; electronic circuitry; processing steps; mechanical device; standard processing; processing step; method comprise; forming electronic; integrating microelectromechanical; electromechanical devices; mechanical devices; microelectromechanical device; /438/

Citation Formats


                    Montague, Stephen, Smith, James H., Sniegowski, Jeffry J., and McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry.  United States: N. p., 1998. 
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                    Montague, Stephen, Smith, James H., Sniegowski, Jeffry J., & McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry.  United States.

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                    Montague, Stephen, Smith, James H., Sniegowski, Jeffry J., and McWhorter, Paul J. Thu .  
        "Method for integrating microelectromechanical devices with electronic circuitry".  United States.  https://www.osti.gov/servlets/purl/871797.

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@article{osti_871797,

  title        = {Method for integrating microelectromechanical devices with electronic circuitry},

  author       = {Montague, Stephen and Smith, James H. and Sniegowski, Jeffry J. and McWhorter, Paul J.},

  abstractNote = {A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1998},

  month        = {1}

}

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