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Title: Method for integrating microelectromechanical devices with electronic circuitry

Abstract

A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.

Inventors:
 [1];  [1];  [1];  [1]
  1. (Albuquerque, NM)
Issue Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
871797
Patent Number(s):
5798283
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; integrating; microelectromechanical; devices; electronic; circuitry; comprises; steps; forming; device; cavity; below; surface; substrate; encapsulating; prior; releasing; operation; fabrication; planarization; encapsulated; formation; allows; standard; processing; microelectromechanical devices; device surface; electronic circuit; method comprises; electronic circuitry; processing steps; mechanical device; standard processing; processing step; method comprise; forming electronic; integrating microelectromechanical; electromechanical devices; mechanical devices; microelectromechanical device; /438/

Citation Formats

Montague, Stephen, Smith, James H., Sniegowski, Jeffry J., and McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry. United States: N. p., 1998. Web.
Montague, Stephen, Smith, James H., Sniegowski, Jeffry J., & McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry. United States.
Montague, Stephen, Smith, James H., Sniegowski, Jeffry J., and McWhorter, Paul J. Thu . "Method for integrating microelectromechanical devices with electronic circuitry". United States. https://www.osti.gov/servlets/purl/871797.
@article{osti_871797,
title = {Method for integrating microelectromechanical devices with electronic circuitry},
author = {Montague, Stephen and Smith, James H. and Sniegowski, Jeffry J. and McWhorter, Paul J.},
abstractNote = {A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {1}
}

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