Method for integrating microelectromechanical devices with electronic circuitry
Abstract
A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 871797
- Patent Number(s):
- 5798283
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; integrating; microelectromechanical; devices; electronic; circuitry; comprises; steps; forming; device; cavity; below; surface; substrate; encapsulating; prior; releasing; operation; fabrication; planarization; encapsulated; formation; allows; standard; processing; microelectromechanical devices; device surface; electronic circuit; method comprises; electronic circuitry; processing steps; mechanical device; standard processing; processing step; method comprise; forming electronic; integrating microelectromechanical; electromechanical devices; mechanical devices; microelectromechanical device; /438/
Citation Formats
Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, and McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry. United States: N. p., 1998.
Web.
Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, & McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry. United States.
Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, and McWhorter, Paul J. Thu .
"Method for integrating microelectromechanical devices with electronic circuitry". United States. https://www.osti.gov/servlets/purl/871797.
@article{osti_871797,
title = {Method for integrating microelectromechanical devices with electronic circuitry},
author = {Montague, Stephen and Smith, James H and Sniegowski, Jeffry J and McWhorter, Paul J},
abstractNote = {A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {1}
}
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