Method for integrating microelectromechanical devices with electronic circuitry

Title: Method for integrating microelectromechanical devices with electronic circuitry

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Abstract

A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.

Inventors:

Montague, Stephen ^[1]; Smith, James H ^[1]; Sniegowski, Jeffry J ^[1]; McWhorter, Paul J ^[1]

Albuquerque, NM

Issue Date:: 1998-01-01

Research Org.:: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

OSTI Identifier:: 871797

Patent Number(s):: 5798283

Assignee:: Sandia Corporation (Albuquerque, NM)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS

G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES

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B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
B81C2203/0728 - Pre-CMOS, i.e. forming the micromechanical structure before the CMOS circuit

G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
G03F7/094 - {Multilayer resist systems, e.g. planarising layers}

G - PHYSICS G01 - MEASURING G01P - MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK
G01P2015/0828 - {the mass being of the paddle type being suspended at one of its longitudinal ends}

B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
B81C1/00246 - {Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate}

G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
G03F9/70 - {for microlithography

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: method; integrating; microelectromechanical; devices; electronic; circuitry; comprises; steps; forming; device; cavity; below; surface; substrate; encapsulating; prior; releasing; operation; fabrication; planarization; encapsulated; formation; allows; standard; processing; microelectromechanical devices; device surface; electronic circuit; method comprises; electronic circuitry; processing steps; mechanical device; standard processing; processing step; method comprise; forming electronic; integrating microelectromechanical; electromechanical devices; mechanical devices; microelectromechanical device; /438/

Citation Formats


                    Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, and McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry.  United States: N. p., 1998. 
        Web.

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                    Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, & McWhorter, Paul J. Method for integrating microelectromechanical devices with electronic circuitry.  United States.

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                    Montague, Stephen, Smith, James H, Sniegowski, Jeffry J, and McWhorter, Paul J. Thu .  
        "Method for integrating microelectromechanical devices with electronic circuitry".  United States.  https://www.osti.gov/servlets/purl/871797.

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@article{osti_871797,

  title        = {Method for integrating microelectromechanical devices with electronic circuitry},

  author       = {Montague, Stephen and Smith, James H and Sniegowski, Jeffry J and McWhorter, Paul J},

  abstractNote = {A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1998},

  month        = {1}

}

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