Variable pin fin construction to facilitate compliant cold plates

Schultz, Mark Delorman

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
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A24 - tobacco
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Title: Variable pin fin construction to facilitate compliant cold plates

Abstract

A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

Inventors:: Schultz, Mark Delorman

Issue Date:: 2022-11-29

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1986870

Patent Number(s):: 11515230

Application Number:: 16/676,515

Assignee:: International Business Machines Corporation (Armonk, NY)

DOE Contract Number:: B604142

Resource Type:: Patent

Resource Relation:: Patent File Date: 11/07/2019

Country of Publication:: United States

Language:: English

Citation Formats


                    Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates.  United States: N. p., 2022. 
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                    Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates.  United States.

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                    Schultz, Mark Delorman. Tue .  
        "Variable pin fin construction to facilitate compliant cold plates".  United States.  https://www.osti.gov/servlets/purl/1986870.

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@article{osti_1986870,

  title        = {Variable pin fin construction to facilitate compliant cold plates},

  author       = {Schultz, Mark Delorman},

  abstractNote = {A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2022},

  month        = {11}

}

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Works referenced in this record:

Heat Sink and Integrated Circuit Assembly Using the Same
patent-application, June 2011

Lou, Choon Leong
US Patent Application 12/651006; 20110156244
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Area Array Packages with Overmolded Pin-Fin Heat Sinks
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Compliant thermal interface structure utilizing spring elements
patent, April 2008

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High performance cold plate for electronic cooling
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Heat exchanger
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Symonds, Keith Thomas
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End fed liquid heat exchanger for an electronic component
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Laminated Heat Exchanger
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Cooling structure using rigid movable elements
patent, June 2009

Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
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Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
patent, April 2015

Bharathan, Desikan; Bennion, Kevin; Kelly, Kenneth
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Compliant thermal interface structure utilizing spring elements
patent, June 2009

Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
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patent-application, August 2013

Karidis, John P.; Schultz, Mark D.
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Liquid-Cooling Apparatus with Integrated Coolant Filter
patent-application, June 2015

Campbell, Levi A.; Chu, Richard C.; David, Milnes P.
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Tong, Wei; Boyland, John
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Variable pin fin construction to facilitate compliant cold plates

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Similar Records

Title: Variable pin fin construction to facilitate compliant cold plates

Abstract

Citation Formats

Heat Sink and Integrated Circuit Assembly Using the Same patent-application, June 2011

Area Array Packages with Overmolded Pin-Fin Heat Sinks patent-application, July 2005

Integrated circuit package system with a heat sink patent, October 2011

Compliant thermal interface structure with vapor chamber patent, September 2007

Compliant thermal interface structure utilizing spring elements patent, April 2008

High performance cold plate for electronic cooling patent, October 2003

Heat exchanger patent, November 2005

End fed liquid heat exchanger for an electronic component patent, December 1989

Laminated Heat Exchanger patent-application, July 2012

Liquid-Cooling Apparatus with Integrated Coolant Filter patent-application, December 2015

Cooling structure using rigid movable elements patent, June 2009

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices patent, April 2015

Compliant thermal interface structure utilizing spring elements patent, June 2009

Enhanced heat transfer structure with heat transfer members of variable density patent, May 2005

Integrated circuit stack patent, February 2014

Integrated circuit stack patent, January 2013

Heat Exchanger patent-application, July 2010

Heat Sink patent-application, May 2013

Enhanced Heat Transfer Structure with Heat Transfer Members of Variable Density patent-application, December 2003

Flow Balancing Scheme for Two-Phase Refrigerant Cooled Rack patent-application, April 2012

Heat Transfer Surfaces with Flanged Apertures patent-application, February 2008

Compliant Pin Fin Heat Sink and Methods patent-application, August 2013

Liquid-Cooling Apparatus with Integrated Coolant Filter patent-application, June 2015

Heat Sink patent-application, March 2008

Heat Sink and Integrated Circuit Assembly Using the Same
patent-application, June 2011

Area Array Packages with Overmolded Pin-Fin Heat Sinks
patent-application, July 2005

Integrated circuit package system with a heat sink
patent, October 2011

Compliant thermal interface structure with vapor chamber
patent, September 2007

Compliant thermal interface structure utilizing spring elements
patent, April 2008

High performance cold plate for electronic cooling
patent, October 2003

Heat exchanger
patent, November 2005

End fed liquid heat exchanger for an electronic component
patent, December 1989

Laminated Heat Exchanger
patent-application, July 2012

Liquid-Cooling Apparatus with Integrated Coolant Filter
patent-application, December 2015

Cooling structure using rigid movable elements
patent, June 2009

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
patent, April 2015

Compliant thermal interface structure utilizing spring elements
patent, June 2009

Enhanced heat transfer structure with heat transfer members of variable density
patent, May 2005

Integrated circuit stack
patent, February 2014

Integrated circuit stack
patent, January 2013

Heat Exchanger
patent-application, July 2010

Heat Sink
patent-application, May 2013

Enhanced Heat Transfer Structure with Heat Transfer Members of Variable Density
patent-application, December 2003

Flow Balancing Scheme for Two-Phase Refrigerant Cooled Rack
patent-application, April 2012

Heat Transfer Surfaces with Flanged Apertures
patent-application, February 2008

Compliant Pin Fin Heat Sink and Methods
patent-application, August 2013

Liquid-Cooling Apparatus with Integrated Coolant Filter
patent-application, June 2015

Heat Sink
patent-application, March 2008