Variable pin fin construction to facilitate compliant cold plates

Title: Variable pin fin construction to facilitate compliant cold plates

Abstract

A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

Inventors:: Schultz, Mark Delorman

Issue Date:: 2019-12-10

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1600391

Patent Number(s):: 10,504,814

Application Number:: 15/264,292

Assignee:: International Business Machines Corporation (Armonk, NY)

DOE Contract Number:: B604142

Resource Type:: Patent

Resource Relation:: Patent File Date: 09/13/2016

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 97 MATHEMATICS AND COMPUTING

Citation Formats


                    Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates.  United States: N. p., 2019. 
        Web.

Copy to clipboard


                    Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates.  United States.

Copy to clipboard


                    Schultz, Mark Delorman. Tue .  
        "Variable pin fin construction to facilitate compliant cold plates".  United States.  https://www.osti.gov/servlets/purl/1600391.

Copy to clipboard


                    
@article{osti_1600391,

  title        = {Variable pin fin construction to facilitate compliant cold plates},

  author       = {Schultz, Mark Delorman},

  abstractNote = {A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {12}

}

Copy to clipboard

Patent:

View Patent

Save / Share:

Export Metadata

Save to My Library

Works referenced in this record:

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
patent, April 2015

Bharathan, Desikan; Bennion, Kevin; Kelly, Kenneth
US Patent Document 9,010,405
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=9010405

Integrated circuit stack
patent, February 2014

Brunschwiler, Thomas J.; Linderman, Ryan; Michel, Bruno
US Patent Document 8,659,898
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=8659898

Heat Exchanger
patent-application, July 2010

Bertolotti, Fabio P.; Sabatino, Daniel R.
US Patent Application 12/348582; 20100170667
URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220100170667%22.PGNR.&OS=DN/20100170667&RS=DN/20100170667

Compliant thermal interface structure with vapor chamber
patent, September 2007

Karidis, John; Schultz, Mark; Webb, Bucknell
US Patent Document 7,264,041
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7264041

High performance cold plate for electronic cooling
patent, October 2003

Ognibene, Edward J.; Holmansky, Evgeny N.; Johnson, Douglas L.
US Patent Document 6,634,421
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6634421

Integrated circuit stack
patent, January 2013

Brunschwiler, Thomas J.; Linderman, Ryan; Michel, Bruno
US Patent Document 8,363,402
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=8363402

End fed liquid heat exchanger for an electronic component
patent, December 1989

Nelson, Richard D.; Gupta, Omkarnath R.
US Patent Document 4,884,630
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=4884630

Heat exchanger
patent, November 2005

Symonds, Keith Thomas
US Patent Document 6,968,892
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6968892

Cooling structure using rigid movable elements
patent, June 2009

Karidis, John; Schultz, Mark; Webb, Bucknell
US Patent Document 7,545,648
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7545648

Compliant thermal interface structure utilizing spring elements
patent, June 2009

Karidis, John; Schultz, Mark; Webb, Bucknell
US Patent Document 7,545,647
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7545647

Compliant thermal interface structure utilizing spring elements
patent, April 2008

Karidis, John; Schultz, Mark; Webb, Bucknell
US Patent Document 7,355,855
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7355855

Enhanced heat transfer structure with heat transfer members of variable density
patent, May 2005

Dessiatoun, Serguei V.; Ivakhnenko, Igor
US Patent Document 6,898,082
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6898082

Similar records in DOE Patents and OSTI.GOV collections:

Pin fin compliant heat sink with enhanced flexibility

Patent Schultz, Mark D.

Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.
Full Text Available
Pin fin compliant heat sink with enhanced flexibility

Patent Schultz, Mark D.

Methods of using heat sinks include placing a pin fin compliant heat sink on a non-flat surface. The pin fin complaint heat sink has top and bottom plates connected by a plurality of pins arranged vertically between the top and bottom plates. The top and bottom plates are vertically conformed to local deviations of the non-flat surface. The top and bottom plates are laterally conformed to an overall shape of the surface. At least either the top or bottom plate is corrugated.
Full Text Available
Energy star compliant voice over internet protocol (VoIP) telecommunications network including energy star compliant VoIP devices

Patent Kouchri, Farrokh Mohammadzadeh

A Voice over Internet Protocol (VoIP) communications system, a method of managing a communications network in such a system and a program product therefore. The system/network includes an ENERGY STAR (E-star) aware softswitch and E-star compliant communications devices at system endpoints. The E-star aware softswitch allows E-star compliant communications devices to enter and remain in power saving mode. The E-star aware softswitch spools messages and forwards only selected messages (e.g., calls) to the devices in power saving mode. When the E-star compliant communications devices exit power saving mode, the E-star aware softswitch forwards spooled messages.
Full Text Available
Coincident site lattice-matched growth of semiconductors on substrates using compliant buffer layers

Patent Norman, Andrew

A method of producing semiconductor materials and devices that incorporate the semiconductor materials are provided. In particular, a method is provided of producing a semiconductor material, such as a III-V semiconductor, on a silicon substrate using a compliant buffer layer, and devices such as photovoltaic cells that incorporate the semiconductor materials. The compliant buffer material and semiconductor materials may be deposited using coincident site lattice-matching epitaxy, resulting in a close degree of lattice matching between the substrate material and deposited material for a wide variety of material compositions. The coincident site lattice matching epitaxial process, as well as the usemore »« less
Full Text Available
Near-chip compliant layer for reducing perimeter stress during assembly process

Patent Schultz, Mark D.; Takken, Todd E.; Tian, Shurong; ...

A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that wouldmore »« less
Full Text Available

Similar Records

Title: Variable pin fin construction to facilitate compliant cold plates

Abstract

Citation Formats

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices patent, April 2015

Integrated circuit stack patent, February 2014

Heat Exchanger patent-application, July 2010

Compliant thermal interface structure with vapor chamber patent, September 2007

High performance cold plate for electronic cooling patent, October 2003

Integrated circuit stack patent, January 2013

End fed liquid heat exchanger for an electronic component patent, December 1989

Heat exchanger patent, November 2005

Cooling structure using rigid movable elements patent, June 2009

Compliant thermal interface structure utilizing spring elements patent, June 2009

Compliant thermal interface structure utilizing spring elements patent, April 2008

Enhanced heat transfer structure with heat transfer members of variable density patent, May 2005

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
patent, April 2015

Integrated circuit stack
patent, February 2014

Heat Exchanger
patent-application, July 2010

Compliant thermal interface structure with vapor chamber
patent, September 2007

High performance cold plate for electronic cooling
patent, October 2003

Integrated circuit stack
patent, January 2013

End fed liquid heat exchanger for an electronic component
patent, December 1989

Heat exchanger
patent, November 2005

Cooling structure using rigid movable elements
patent, June 2009

Compliant thermal interface structure utilizing spring elements
patent, June 2009

Compliant thermal interface structure utilizing spring elements
patent, April 2008

Enhanced heat transfer structure with heat transfer members of variable density
patent, May 2005