Variable pin fin construction to facilitate compliant cold plates
Abstract
A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1600391
- Patent Number(s):
- 10504814
- Application Number:
- 15/264,292
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- DOE Contract Number:
- B604142
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 09/13/2016
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 97 MATHEMATICS AND COMPUTING
Citation Formats
Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates. United States: N. p., 2019.
Web.
Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates. United States.
Schultz, Mark Delorman. Tue .
"Variable pin fin construction to facilitate compliant cold plates". United States. https://www.osti.gov/servlets/purl/1600391.
@article{osti_1600391,
title = {Variable pin fin construction to facilitate compliant cold plates},
author = {Schultz, Mark Delorman},
abstractNote = {A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {12}
}
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