skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Variable pin fin construction to facilitate compliant cold plates

Abstract

A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

Inventors:
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600391
Patent Number(s):
10,504,814
Application Number:
15/264,292
Assignee:
International Business Machines Corporation (Armonk, NY)
DOE Contract Number:  
B604142
Resource Type:
Patent
Resource Relation:
Patent File Date: 09/13/2016
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 97 MATHEMATICS AND COMPUTING

Citation Formats

Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates. United States: N. p., 2019. Web.
Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates. United States.
Schultz, Mark Delorman. Tue . "Variable pin fin construction to facilitate compliant cold plates". United States. https://www.osti.gov/servlets/purl/1600391.
@article{osti_1600391,
title = {Variable pin fin construction to facilitate compliant cold plates},
author = {Schultz, Mark Delorman},
abstractNote = {A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {12}
}

Patent:

Save / Share:

Works referenced in this record:

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
patent, April 2015


Integrated circuit stack
patent, February 2014


Compliant thermal interface structure with vapor chamber
patent, September 2007


High performance cold plate for electronic cooling
patent, October 2003


Integrated circuit stack
patent, January 2013


End fed liquid heat exchanger for an electronic component
patent, December 1989


Heat exchanger
patent, November 2005


Cooling structure using rigid movable elements
patent, June 2009


Compliant thermal interface structure utilizing spring elements
patent, June 2009


Compliant thermal interface structure utilizing spring elements
patent, April 2008


Enhanced heat transfer structure with heat transfer members of variable density
patent, May 2005