Variable pin fin construction to facilitate compliant cold plates

Schultz, Mark Delorman

Title: Variable pin fin construction to facilitate compliant cold plates

Abstract

A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

Inventors:: Schultz, Mark Delorman

Issue Date:: 2019-12-10

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1600391

Patent Number(s):: 10504814

Application Number:: 15/264,292

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L23/473 - by flowing liquids {
H01L23/3677 - {Wire-like or pin-like cooling fins or heat sinks}

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
F28D9/0031 - {the conduits for one heat-exchange medium being formed by paired plates touching each other

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L21/4882 - {Assembly of heatsink parts}

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/12507 - More than two components

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L23/467 - by flowing gases, e.g. air {
H01L21/4885 - {Wire-like parts or pins

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DOE Contract Number:: B604142

Resource Type:: Patent

Resource Relation:: Patent File Date: 09/13/2016

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 97 MATHEMATICS AND COMPUTING

Citation Formats


                    Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates.  United States: N. p., 2019. 
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                    Schultz, Mark Delorman. Variable pin fin construction to facilitate compliant cold plates.  United States.

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                    Schultz, Mark Delorman. Tue .  
        "Variable pin fin construction to facilitate compliant cold plates".  United States.  https://www.osti.gov/servlets/purl/1600391.

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@article{osti_1600391,

  title        = {Variable pin fin construction to facilitate compliant cold plates},

  author       = {Schultz, Mark Delorman},

  abstractNote = {A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {12}

}

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Works referenced in this record:

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
patent, April 2015

Bharathan, Desikan; Bennion, Kevin; Kelly, Kenneth
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Compliant thermal interface structure utilizing spring elements
patent, June 2009

Karidis, John; Schultz, Mark; Webb, Bucknell
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Compliant thermal interface structure utilizing spring elements
patent, April 2008

Karidis, John; Schultz, Mark; Webb, Bucknell
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patent, May 2005

Dessiatoun, Serguei V.; Ivakhnenko, Igor
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Title: Variable pin fin construction to facilitate compliant cold plates

Abstract

Citation Formats

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices patent, April 2015

Integrated circuit stack patent, February 2014

Heat Exchanger patent-application, July 2010

Compliant thermal interface structure with vapor chamber patent, September 2007

High performance cold plate for electronic cooling patent, October 2003

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Heat exchanger patent, November 2005

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Compliant thermal interface structure utilizing spring elements patent, June 2009

Compliant thermal interface structure utilizing spring elements patent, April 2008

Enhanced heat transfer structure with heat transfer members of variable density patent, May 2005

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
patent, April 2015

Integrated circuit stack
patent, February 2014

Heat Exchanger
patent-application, July 2010

Compliant thermal interface structure with vapor chamber
patent, September 2007

High performance cold plate for electronic cooling
patent, October 2003

Integrated circuit stack
patent, January 2013

End fed liquid heat exchanger for an electronic component
patent, December 1989

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patent, November 2005

Cooling structure using rigid movable elements
patent, June 2009

Compliant thermal interface structure utilizing spring elements
patent, June 2009

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