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Title: Pin fin compliant heat sink with enhanced flexibility

Abstract

Methods of using heat sinks include placing a pin fin compliant heat sink on a non-flat surface. The pin fin complaint heat sink has top and bottom plates connected by a plurality of pins arranged vertically between the top and bottom plates. The top and bottom plates are vertically conformed to local deviations of the non-flat surface. The top and bottom plates are laterally conformed to an overall shape of the surface. At least either the top or bottom plate is corrugated.

Inventors:
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1493338
Patent Number(s):
10168108
Application Number:
15/879,913
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2018 Jan 25
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Schultz, Mark D. Pin fin compliant heat sink with enhanced flexibility. United States: N. p., 2019. Web.
Schultz, Mark D. Pin fin compliant heat sink with enhanced flexibility. United States.
Schultz, Mark D. Tue . "Pin fin compliant heat sink with enhanced flexibility". United States. https://www.osti.gov/servlets/purl/1493338.
@article{osti_1493338,
title = {Pin fin compliant heat sink with enhanced flexibility},
author = {Schultz, Mark D.},
abstractNote = {Methods of using heat sinks include placing a pin fin compliant heat sink on a non-flat surface. The pin fin complaint heat sink has top and bottom plates connected by a plurality of pins arranged vertically between the top and bottom plates. The top and bottom plates are vertically conformed to local deviations of the non-flat surface. The top and bottom plates are laterally conformed to an overall shape of the surface. At least either the top or bottom plate is corrugated.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {1}
}

Works referenced in this record:

Flexible finned heat exchanger
patent, June 1991


Pluggable chip scale package
patent, June 2000


Compliant thermal interface structure with vapor chamber
patent, September 2007


Compliant thermal interface structure utilizing spring elements
patent, April 2008


Cooling structure using rigid movable elements
patent, April 2008


Flexible heat sink
patent, July 2008


Compliant thermal interface structure utilizing spring elements with fins
patent, August 2008


Integrated cooling system
patent, January 2009


Compliant thermal interface structure utilizing spring elements
patent, June 2009


Cooling structure using rigid movable elements
patent, June 2009


Cooling apparatus for microelectronic devices
patent, December 2010


Integrated circuit package system with a heat sink
patent, October 2011


Compliant pin fin heat sink and methods
patent, August 2016