Pin fin compliant heat sink with enhanced flexibility

Schultz, Mark D.

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
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A42 - headwear
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B03 - separation of solid materials using liquids or using pneumatic tables or jigs
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Title: Pin fin compliant heat sink with enhanced flexibility

Abstract

Methods of using heat sinks include placing a pin fin compliant heat sink on a non-flat surface. The pin fin complaint heat sink has top and bottom plates connected by a plurality of pins arranged vertically between the top and bottom plates. The top and bottom plates are vertically conformed to local deviations of the non-flat surface. The top and bottom plates are laterally conformed to an overall shape of the surface. At least either the top or bottom plate is corrugated.

Inventors:: Schultz, Mark D.

Issue Date:: 2019-01-01

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1493338

Patent Number(s):: 10168108

Application Number:: 15/879,913

Assignee:: INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

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B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL
B23P15/26 - heat exchangers {or the like

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
F28F3/022 - {the means being wires or pins}

Show less

DOE Contract Number:: EE0002894

Resource Type:: Patent

Resource Relation:: Patent File Date: 2018 Jan 25

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Schultz, Mark D. Pin fin compliant heat sink with enhanced flexibility.  United States: N. p., 2019. 
        Web.

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                    Schultz, Mark D. Pin fin compliant heat sink with enhanced flexibility.  United States.

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                    Schultz, Mark D. Tue .  
        "Pin fin compliant heat sink with enhanced flexibility".  United States.  https://www.osti.gov/servlets/purl/1493338.

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@article{osti_1493338,

  title        = {Pin fin compliant heat sink with enhanced flexibility},

  author       = {Schultz, Mark D.},

  abstractNote = {Methods of using heat sinks include placing a pin fin compliant heat sink on a non-flat surface. The pin fin complaint heat sink has top and bottom plates connected by a plurality of pins arranged vertically between the top and bottom plates. The top and bottom plates are vertically conformed to local deviations of the non-flat surface. The top and bottom plates are laterally conformed to an overall shape of the surface. At least either the top or bottom plate is corrugated.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {1}

}

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Works referenced in this record:

Flexible finned heat exchanger
patent, June 1991

Flint, Ephraim B.; Grebe, Kurt R.; Gruber, Peter A.
US Patent Document 5,022,462
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5022462

Compliant thermal connectors, methods of making the same and assemblies incorporating the same
patent, July 1997

DiStefano, Thomas H.; Smith, John W.
US Patent Document 5,650,914
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Pluggable chip scale package
patent, June 2000

Beaman, Brian S.; Fogel, Keith E.; Lauro, Paul A.
US Patent Document 6,078,500
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Flexibly suspended heat exchange head for a DUT
patent, May 2002

Jones, Elmer R.
US Patent Document 6,392,431
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Flexible heat exchangers for medical cooling and warming applications
patent, July 2006

Fletcher, R. David; Chen, Yunquan
US Patent Document 7,077,858
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Compliant thermal interface structure with vapor chamber
patent, September 2007

Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
US Patent Document 7,264,041
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7264041

Compliant thermal interface structure utilizing spring elements
patent, April 2008

Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
US Patent Document 7,355,855
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7355855

Cooling structure using rigid movable elements
patent, April 2008

Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
US Patent Document 7,362,582
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7362582

Flexible heat sink
patent, July 2008

McCutcheon, Jeffrey W.; Narum, Timothy N.; Soo, Philip P.
US Patent Document 7,399,919
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7399919

Compliant thermal interface structure utilizing spring elements with fins
patent, August 2008

Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
US Patent Document 7,408,780
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Integrated cooling system
patent, January 2009

Nelson, Richard D.; Somadder, Anjan
US Patent Document RE40,618
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Compliant thermal interface structure utilizing spring elements
patent, June 2009

Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
US Patent Document 7,545,647
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7545647

Cooling structure using rigid movable elements
patent, June 2009

Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
US Patent Document 7,545,648
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7545648

Cooling apparatus for microelectronic devices
patent, December 2010

Di Stefano, Peter T.; Di Stefano, Thomas H.
US Patent Document 7,849,914
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7849914

Integrated circuit package system with a heat sink
patent, October 2011

Lee, Sangkwon; Lee, Tae Keun
US Patent Document 8,030,755
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8030755

Flexible heat sink with lateral compliance
patent, May 2014

Schultz, Mark D.
US Patent Document 8,736,048
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8736048

Compliant pin fin heat sink and methods
patent, August 2016

Karidis, John P.; Schultz, Mark D.
US Patent Document 9,425,124
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/9425124

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Similar Records

Title: Pin fin compliant heat sink with enhanced flexibility

Abstract

Citation Formats

Flexible finned heat exchanger patent, June 1991

Compliant thermal connectors, methods of making the same and assemblies incorporating the same patent, July 1997

Pluggable chip scale package patent, June 2000

Flexibly suspended heat exchange head for a DUT patent, May 2002

Flexible heat exchangers for medical cooling and warming applications patent, July 2006

Compliant thermal interface structure with vapor chamber patent, September 2007

Compliant thermal interface structure utilizing spring elements patent, April 2008

Cooling structure using rigid movable elements patent, April 2008

Flexible heat sink patent, July 2008

Compliant thermal interface structure utilizing spring elements with fins patent, August 2008

Integrated cooling system patent, January 2009

Compliant thermal interface structure utilizing spring elements patent, June 2009

Cooling structure using rigid movable elements patent, June 2009

Cooling apparatus for microelectronic devices patent, December 2010

Integrated circuit package system with a heat sink patent, October 2011

Flexible heat sink with lateral compliance patent, May 2014

Compliant pin fin heat sink and methods patent, August 2016

Flexible finned heat exchanger
patent, June 1991

Compliant thermal connectors, methods of making the same and assemblies incorporating the same
patent, July 1997

Pluggable chip scale package
patent, June 2000

Flexibly suspended heat exchange head for a DUT
patent, May 2002

Flexible heat exchangers for medical cooling and warming applications
patent, July 2006

Compliant thermal interface structure with vapor chamber
patent, September 2007

Compliant thermal interface structure utilizing spring elements
patent, April 2008

Cooling structure using rigid movable elements
patent, April 2008

Flexible heat sink
patent, July 2008

Compliant thermal interface structure utilizing spring elements with fins
patent, August 2008

Integrated cooling system
patent, January 2009

Compliant thermal interface structure utilizing spring elements
patent, June 2009

Cooling structure using rigid movable elements
patent, June 2009

Cooling apparatus for microelectronic devices
patent, December 2010

Integrated circuit package system with a heat sink
patent, October 2011

Flexible heat sink with lateral compliance
patent, May 2014

Compliant pin fin heat sink and methods
patent, August 2016