Monolithic integrated quantum dot photonic integrated circuits
Abstract
A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of California, Oakland, CA (United States)
- Sponsoring Org.:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E)
- OSTI Identifier:
- 1925067
- Patent Number(s):
- 11435524
- Application Number:
- 17/058,057
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- DOE Contract Number:
- AR0000672
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 05/24/2019
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 77 NANOSCIENCE AND NANOTECHNOLOGY
Citation Formats
Bowers, John E., Gossard, Arthur, Jung, Daehwan, Norman, Justin, Shang, Chen, and Wan, Yating. Monolithic integrated quantum dot photonic integrated circuits. United States: N. p., 2022.
Web.
Bowers, John E., Gossard, Arthur, Jung, Daehwan, Norman, Justin, Shang, Chen, & Wan, Yating. Monolithic integrated quantum dot photonic integrated circuits. United States.
Bowers, John E., Gossard, Arthur, Jung, Daehwan, Norman, Justin, Shang, Chen, and Wan, Yating. Tue .
"Monolithic integrated quantum dot photonic integrated circuits". United States. https://www.osti.gov/servlets/purl/1925067.
@article{osti_1925067,
title = {Monolithic integrated quantum dot photonic integrated circuits},
author = {Bowers, John E. and Gossard, Arthur and Jung, Daehwan and Norman, Justin and Shang, Chen and Wan, Yating},
abstractNote = {A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {9}
}
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