Title: Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion

Abstract

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

Inventors:

Menard, Etienne; Rogers, John A.; Kim, Seok; Carlson, Andrew

Issue Date:

2020-07-21

Research Org.:

X Display Co. Technology, Ltd., Dublin (Ireland); Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1735038

Patent Number(s):

10717267

Application Number:

15/195,747

Assignee:

X Display Company Technology Limited (Dublin, IE); The Board of Trustees of the University of Illinois (Urbana, IL)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

B - PERFORMING OPERATIONS B41 - PRINTING B41F - PRINTING MACHINES OR PRESSES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2224/32145 - the bodies being stacked

B - PERFORMING OPERATIONS B41 - PRINTING B41F - PRINTING MACHINES OR PRESSES

B41F16/00 - Transfer printing apparatus

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

B32B9/005 - {comprising one layer of ceramic material, e.g. porcelain, ceramic tile

B - PERFORMING OPERATIONS B41 - PRINTING B41F - PRINTING MACHINES OR PRESSES

B41F16/006 - {Arrangements for moving, supporting or positioning the printing foil or band}

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

B32B37/025 - {Transfer laminating}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2224/83192 - wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
H01L2221/68368 - used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
H01L2221/68363 - used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
H01L25/50 - {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

B32B37/16 - with all layers existing as coherent layers before laminating

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L21/6835 - {using temporarily an auxiliary support}

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

B32B2457/14 - Semiconductor wafers
B32B41/00 - Arrangements for controlling or monitoring lamination processes

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2224/95001 - involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
H01L2221/68381 - Details of chemical or physical process used for separating the auxiliary support from a device or wafer
H01L23/4821 - {Bridge structure with air gap}
H01L21/67144 - {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
H01L21/67132 - {Apparatus for placing on an insulating substrate, e.g. tape}

B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS

B81C1/00373 - {Selective deposition, e.g. printing or microcontact printing}

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

B32B2313/00 - Elements other than metals

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DOE Contract Number:  

FG02-91ER45439

Resource Type:

Patent

Resource Relation:

Patent File Date: 06/28/2016

Country of Publication:

United States

Language:

English