Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
Abstract
In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.
- Inventors:
- Issue Date:
- Research Org.:
- X Display Co. Technology, Ltd., Dublin (Ireland); Univ. of Illinois at Urbana-Champaign, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1735038
- Patent Number(s):
- 10717267
- Application Number:
- 15/195,747
- Assignee:
- X Display Company Technology Limited (Dublin, IE); The Board of Trustees of the University of Illinois (Urbana, IL)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
B - PERFORMING OPERATIONS B41 - PRINTING B41F - PRINTING MACHINES OR PRESSES
- DOE Contract Number:
- FG02-91ER45439
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 06/28/2016
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States: N. p., 2020.
Web.
Menard, Etienne, Rogers, John A., Kim, Seok, & Carlson, Andrew. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion. United States.
Menard, Etienne, Rogers, John A., Kim, Seok, and Carlson, Andrew. Tue .
"Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion". United States. https://www.osti.gov/servlets/purl/1735038.
@article{osti_1735038,
title = {Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion},
author = {Menard, Etienne and Rogers, John A. and Kim, Seok and Carlson, Andrew},
abstractNote = {In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 21 00:00:00 EDT 2020},
month = {Tue Jul 21 00:00:00 EDT 2020}
}
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