Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
Abstract
The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of `soft adhesion` to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.
- Inventors:
-
- Champaign, IL
- Urbana, IL
- Tokyo, JP
- Issue Date:
- Research Org.:
- Univ. of Illinois at Urbana-Champaign, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1020252
- Patent Number(s):
- 7943491
- Application Number:
- 11/423,192
- Assignee:
- The Board of Trustees of the University of Illinois (Urbana, IL)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- FG02-91ER45439
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 77 NANOSCIENCE AND NANOTECHNOLOGY
Citation Formats
Nuzzo, Ralph G, Rogers, John A, Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, and Zhu, Zhengtao. Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp. United States: N. p., 2011.
Web.
Nuzzo, Ralph G, Rogers, John A, Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, & Zhu, Zhengtao. Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp. United States.
Nuzzo, Ralph G, Rogers, John A, Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, and Zhu, Zhengtao. Tue .
"Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp". United States. https://www.osti.gov/servlets/purl/1020252.
@article{osti_1020252,
title = {Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp},
author = {Nuzzo, Ralph G and Rogers, John A and Menard, Etienne and Lee, Keon Jae and Khang, Dahl-Young and Sun, Yugang and Meitl, Matthew and Zhu, Zhengtao},
abstractNote = {The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of `soft adhesion` to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2011},
month = {5}
}
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