High voltage power chip module
Abstract
A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders.
- Inventors:
- Issue Date:
- Research Org.:
- Cree, Inc., Durham, NC (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1479658
- Patent Number(s):
- 10080301
- Application Number:
- 14/516,700
- Assignee:
- Cree, Inc. (Durham, NC)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- SC0008239
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Oct 17
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Passmore, Brandon, and Cole, Zachary. High voltage power chip module. United States: N. p., 2018.
Web.
Passmore, Brandon, & Cole, Zachary. High voltage power chip module. United States.
Passmore, Brandon, and Cole, Zachary. Tue .
"High voltage power chip module". United States. https://www.osti.gov/servlets/purl/1479658.
@article{osti_1479658,
title = {High voltage power chip module},
author = {Passmore, Brandon and Cole, Zachary},
abstractNote = {A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {9}
}
Works referenced in this record:
Energy storage for power flow management and voltage control on an 11kV UK distribution network
conference, January 2009
- Wade, N.; Taylor, P.; Lang, P.
- 20th International Conference and Exhibition on Electricity Distribution (CIRED 2009), IET Conference Publications