Title: High voltage power chip module

Abstract

A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders.

Inventors:

Passmore, Brandon; Cole, Zachary

Issue Date:

Tue Sep 18 00:00:00 EDT 2018

Research Org.:

Cree, Inc., Durham, NC (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1479658

Patent Number(s):

10080301

Application Number:

14/516,700

Assignee:

Cree, Inc. (Durham, NC)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2224/48247 - connecting the wire to a bond pad of the item
H01L2224/48472 - the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
H01L2224/49111 - the connectors connecting two common bonding areas, e.g. Litz or braid wires
H01L23/051 - another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H01L25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices {
H01L25/072 - {the devices being arranged next to each other}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K7/02 - Arrangements of circuit components or wiring on supporting structure
H05K7/1432 - {for power drive units}

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DOE Contract Number:  

SC0008239

Resource Type:

Patent

Resource Relation:

Patent File Date: 2014 Oct 17

Country of Publication:

United States

Language:

English

Subject:

42 ENGINEERING