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Title: High voltage photo-switch package module having encapsulation with profiled metallized concavities

Abstract

A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces metalized with first metallic layers formed thereon, and encapsulated with a dielectric encapsulation material such as for example epoxy. The first metallic layers are exposed through the encapsulation via encapsulation concavities which have a known contour profile, such as a Rogowski edge profile. Second metallic layers are then formed to line the concavities and come in contact with the first metal layer, to form profiled and metalized encapsulation concavities which mitigate enhancement points at the edges of electrodes matingly seated in the concavities. One or more optical waveguides may also be bonded to the substrate for coupling light into the photo-conductive wafer, with the encapsulation also encapsulating the waveguides.

Inventors:
; ; ;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1179014
Patent Number(s):
9,025,919
Application Number:
13/657,746
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Oct 22
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS

Citation Formats

Sullivan, James S, Sanders, David M, Hawkins, Steven A, and Sampayan, Stephen A. High voltage photo-switch package module having encapsulation with profiled metallized concavities. United States: N. p., 2015. Web.
Sullivan, James S, Sanders, David M, Hawkins, Steven A, & Sampayan, Stephen A. High voltage photo-switch package module having encapsulation with profiled metallized concavities. United States.
Sullivan, James S, Sanders, David M, Hawkins, Steven A, and Sampayan, Stephen A. Tue . "High voltage photo-switch package module having encapsulation with profiled metallized concavities". United States. https://www.osti.gov/servlets/purl/1179014.
@article{osti_1179014,
title = {High voltage photo-switch package module having encapsulation with profiled metallized concavities},
author = {Sullivan, James S and Sanders, David M and Hawkins, Steven A and Sampayan, Stephen A},
abstractNote = {A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces metalized with first metallic layers formed thereon, and encapsulated with a dielectric encapsulation material such as for example epoxy. The first metallic layers are exposed through the encapsulation via encapsulation concavities which have a known contour profile, such as a Rogowski edge profile. Second metallic layers are then formed to line the concavities and come in contact with the first metal layer, to form profiled and metalized encapsulation concavities which mitigate enhancement points at the edges of electrodes matingly seated in the concavities. One or more optical waveguides may also be bonded to the substrate for coupling light into the photo-conductive wafer, with the encapsulation also encapsulating the waveguides.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {5}
}

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