High voltage photo-switch package module having encapsulation with profiled metallized concavities
Abstract
A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces metalized with first metallic layers formed thereon, and encapsulated with a dielectric encapsulation material such as for example epoxy. The first metallic layers are exposed through the encapsulation via encapsulation concavities which have a known contour profile, such as a Rogowski edge profile. Second metallic layers are then formed to line the concavities and come in contact with the first metal layer, to form profiled and metalized encapsulation concavities which mitigate enhancement points at the edges of electrodes matingly seated in the concavities. One or more optical waveguides may also be bonded to the substrate for coupling light into the photo-conductive wafer, with the encapsulation also encapsulating the waveguides.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1179014
- Patent Number(s):
- 9,025,919
- Application Number:
- 13/657,746
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012 Oct 22
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS
Citation Formats
Sullivan, James S, Sanders, David M, Hawkins, Steven A, and Sampayan, Stephen A. High voltage photo-switch package module having encapsulation with profiled metallized concavities. United States: N. p., 2015.
Web.
Sullivan, James S, Sanders, David M, Hawkins, Steven A, & Sampayan, Stephen A. High voltage photo-switch package module having encapsulation with profiled metallized concavities. United States.
Sullivan, James S, Sanders, David M, Hawkins, Steven A, and Sampayan, Stephen A. Tue .
"High voltage photo-switch package module having encapsulation with profiled metallized concavities". United States. https://www.osti.gov/servlets/purl/1179014.
@article{osti_1179014,
title = {High voltage photo-switch package module having encapsulation with profiled metallized concavities},
author = {Sullivan, James S and Sanders, David M and Hawkins, Steven A and Sampayan, Stephen A},
abstractNote = {A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces metalized with first metallic layers formed thereon, and encapsulated with a dielectric encapsulation material such as for example epoxy. The first metallic layers are exposed through the encapsulation via encapsulation concavities which have a known contour profile, such as a Rogowski edge profile. Second metallic layers are then formed to line the concavities and come in contact with the first metal layer, to form profiled and metalized encapsulation concavities which mitigate enhancement points at the edges of electrodes matingly seated in the concavities. One or more optical waveguides may also be bonded to the substrate for coupling light into the photo-conductive wafer, with the encapsulation also encapsulating the waveguides.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {5}
}