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Title: Calibrating thermal behavior of electronics

Abstract

A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.

Inventors:
; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1338058
Patent Number(s):
9,534,967
Application Number:
15/154,448
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 May 13
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 97 MATHEMATICS AND COMPUTING

Citation Formats

Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D. Calibrating thermal behavior of electronics. United States: N. p., 2017. Web.
Chainer, Timothy J., Parida, Pritish R., & Schultz, Mark D. Calibrating thermal behavior of electronics. United States.
Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D. Tue . "Calibrating thermal behavior of electronics". United States. https://www.osti.gov/servlets/purl/1338058.
@article{osti_1338058,
title = {Calibrating thermal behavior of electronics},
author = {Chainer, Timothy J. and Parida, Pritish R. and Schultz, Mark D.},
abstractNote = {A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {1}
}

Patent:

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