Calibrating thermal behavior of electronics
Abstract
A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1255137
- Patent Number(s):
- 9354126
- Application Number:
- 13/691,145
- Assignee:
- INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01K - MEASURING TEMPERATURE
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012 Nov 30
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 97 MATHEMATICS AND COMPUTING
Citation Formats
Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D. Calibrating thermal behavior of electronics. United States: N. p., 2016.
Web.
Chainer, Timothy J., Parida, Pritish R., & Schultz, Mark D. Calibrating thermal behavior of electronics. United States.
Chainer, Timothy J., Parida, Pritish R., and Schultz, Mark D. Tue .
"Calibrating thermal behavior of electronics". United States. https://www.osti.gov/servlets/purl/1255137.
@article{osti_1255137,
title = {Calibrating thermal behavior of electronics},
author = {Chainer, Timothy J. and Parida, Pritish R. and Schultz, Mark D.},
abstractNote = {A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {5}
}
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Works referenced in this record:
Power consumption and efficiency of cooling in a Data Center
conference, October 2010
- Itoh, Satoshi; Kodama, Yuetsu; Shimizu, Toshiyuki
- Grid Computing (GRID)