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Title: Solid state lighting component

Abstract

An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Cree, Inc., Goleta, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1176458
Patent Number(s):
8217412
Application Number:
12/883,979
Assignee:
Cree, Inc. (Goleta, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
DOE Contract Number:  
FC26-06NT42932
Resource Type:
Patent
Resource Relation:
Patent File Date: 2010 Sep 16
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION

Citation Formats

Keller, Bernd, Ibbetson, James, Tarsa, Eric, Negley, Gerald, and Yuan, Thomas. Solid state lighting component. United States: N. p., 2012. Web.
Keller, Bernd, Ibbetson, James, Tarsa, Eric, Negley, Gerald, & Yuan, Thomas. Solid state lighting component. United States.
Keller, Bernd, Ibbetson, James, Tarsa, Eric, Negley, Gerald, and Yuan, Thomas. Tue . "Solid state lighting component". United States. https://www.osti.gov/servlets/purl/1176458.
@article{osti_1176458,
title = {Solid state lighting component},
author = {Keller, Bernd and Ibbetson, James and Tarsa, Eric and Negley, Gerald and Yuan, Thomas},
abstractNote = {An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {7}
}

Works referenced in this record:

Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup
journal, April 2005


Vorsicht, Worthülsen!
journal, October 2011