Solid state lighting component
Abstract
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
- Inventors:
- Issue Date:
- Research Org.:
- Cree, Inc., Goleta, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1176458
- Patent Number(s):
- 8217412
- Application Number:
- 12/883,979
- Assignee:
- Cree, Inc. (Goleta, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
- DOE Contract Number:
- FC26-06NT42932
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2010 Sep 16
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
Citation Formats
Keller, Bernd, Ibbetson, James, Tarsa, Eric, Negley, Gerald, and Yuan, Thomas. Solid state lighting component. United States: N. p., 2012.
Web.
Keller, Bernd, Ibbetson, James, Tarsa, Eric, Negley, Gerald, & Yuan, Thomas. Solid state lighting component. United States.
Keller, Bernd, Ibbetson, James, Tarsa, Eric, Negley, Gerald, and Yuan, Thomas. Tue .
"Solid state lighting component". United States. https://www.osti.gov/servlets/purl/1176458.
@article{osti_1176458,
title = {Solid state lighting component},
author = {Keller, Bernd and Ibbetson, James and Tarsa, Eric and Negley, Gerald and Yuan, Thomas},
abstractNote = {An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 10 00:00:00 EDT 2012},
month = {Tue Jul 10 00:00:00 EDT 2012}
}
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Works referenced in this record:
Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup
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