skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Solid state lighting component

Abstract

An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Cree, Inc., Durham, NC (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1351802
Patent Number(s):
9,076,940
Application Number:
13/971,547
Assignee:
Cree, Inc. (Durham, NC)
DOE Contract Number:  
FC26-06NT42932
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Aug 20
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, and Negley, Gerald. Solid state lighting component. United States: N. p., 2015. Web.
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, & Negley, Gerald. Solid state lighting component. United States.
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, and Negley, Gerald. Tue . "Solid state lighting component". United States. https://www.osti.gov/servlets/purl/1351802.
@article{osti_1351802,
title = {Solid state lighting component},
author = {Yuan, Thomas and Keller, Bernd and Ibbetson, James and Tarsa, Eric and Negley, Gerald},
abstractNote = {An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {7}
}

Patent:

Save / Share:

Works referenced in this record:

Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup
journal, April 2005

  • Kim, Jong Kyu; Luo, Hong; Schubert, Eric Fred
  • Japanese Journal of Applied Physics, Vol. 44, Issue No. 21
  • DOI: 10.1143/JJAP.44.L649