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Title: Solid state lighting component

An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
Inventors:
; ; ; ;
Issue Date:
OSTI Identifier:
1351802
Assignee:
Cree, Inc. (Durham, NC) NETL
Patent Number(s):
9,076,940
Application Number:
13/971,547
Contract Number:
FC26-06NT42932
Resource Relation:
Patent File Date: 2013 Aug 20
Research Org:
Cree, Inc., Durham, NC (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Works referenced in this record: