Solid state lighting component
Abstract
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
- Inventors:
- Issue Date:
- Research Org.:
- Cree, Inc., Goleta, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1532092
- Patent Number(s):
- 8698171
- Application Number:
- 13/489,035
- Assignee:
- Cree, Inc. (Goleta, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
- DOE Contract Number:
- FC26-06NT42932
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012-06-05
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, and Negley, Gerald. Solid state lighting component. United States: N. p., 2014.
Web.
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, & Negley, Gerald. Solid state lighting component. United States.
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, and Negley, Gerald. Tue .
"Solid state lighting component". United States. https://www.osti.gov/servlets/purl/1532092.
@article{osti_1532092,
title = {Solid state lighting component},
author = {Yuan, Thomas and Keller, Bernd and Ibbetson, James and Tarsa, Eric and Negley, Gerald},
abstractNote = {An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {4}
}
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