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Title: Solid state lighting component

Abstract

An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Cree, Inc., Goleta, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1532092
Patent Number(s):
8698171
Application Number:
13/489,035
Assignee:
Cree, Inc. (Goleta, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
DOE Contract Number:  
FC26-06NT42932
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012-06-05
Country of Publication:
United States
Language:
English

Citation Formats

Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, and Negley, Gerald. Solid state lighting component. United States: N. p., 2014. Web.
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, & Negley, Gerald. Solid state lighting component. United States.
Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, and Negley, Gerald. Tue . "Solid state lighting component". United States. https://www.osti.gov/servlets/purl/1532092.
@article{osti_1532092,
title = {Solid state lighting component},
author = {Yuan, Thomas and Keller, Bernd and Ibbetson, James and Tarsa, Eric and Negley, Gerald},
abstractNote = {An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {4}
}

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