A model of wafer-curvature measurements of thin-film stress : the role of diffraction and film-thickness gradients.
Journal Article
·
· Proposed for publication in the Journal of Applied Physics.
OSTI ID:993316
No abstract prepared.
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 993316
- Report Number(s):
- SAND2003-2420J
- Journal Information:
- Proposed for publication in the Journal of Applied Physics., Journal Name: Proposed for publication in the Journal of Applied Physics.
- Country of Publication:
- United States
- Language:
- English
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