Thermal interface materials advancements for "beating the heat" in microelectronics.
Conference
·
OSTI ID:988552
No abstract prepared.
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 988552
- Report Number(s):
- SAND2005-1715C
- Country of Publication:
- United States
- Language:
- English
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