Electrical assembly having heat sink protrusions

Patent · Tue Apr 21 00:00:00 EDT 2009

OSTI ID:986562

Rinehart, Lawrence E.; Romero, Guillermo L.

An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.

• Research Organization: Rinehart Motion Systems, LLC, Wilsonville, OR (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: FG02-03ER83768
• Assignee: Rinehart Motion Systems, LLC (Wilsonville, OR)
• Patent Number(s): 7,521,789
• Application Number: 11/017,184; TRN: US201018%%38
• OSTI ID: 986562
• Resource Relation: Patent File Date: 2004 Dec 18
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
COPPER
HEAT SINKS
SEMICONDUCTOR DEVICES
SUBSTRATES
DESIGN
TEMPERATURE CONTROL