Assessment of NiPd finished components for surface mount assembly applications
Conference
·
OSTI ID:97273
- AT and T Bell Laboratories, Princeton, NJ (United States)
- Sandia National Labs., Albuquerque, NM (United States)
- AMD Incorporated, Santa Clara, CA (United States)
Recent trends towards finer pitch devices and assembly with lead free solders have resulted in increased interest in NiPd plated component leads by the electronics industry. This paper discusses the performance of NiPd fine pitch components as determined by wettability, assembly performance and solder joint reliability. Assembly evaluations were performed with a lead free solder as well as with eutectic SnPb solder. The compatibility of the NiPd component leads with different circuit board finishes (metallic and organic azole) will also be discussed.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 97273
- Report Number(s):
- SAND--95-1639C; CONF-9508140--2; ON: DE95015774
- Country of Publication:
- United States
- Language:
- English
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