Wave soldering with Pb-free solders
Conference
·
OSTI ID:97104
- AT and T Bell Labs., Princeton, NJ (United States)
- Sandia National Labs., Albuquerque, NM (United States)
The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 97104
- Report Number(s):
- SAND--95-1372C; CONF-9508140--4; ON: DE95014888
- Country of Publication:
- United States
- Language:
- English
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