Electrodeposition of high aspect ratio microstructures through thick resist.
Conference
·
OSTI ID:964564
Abstract Not Provided
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 964564
- Report Number(s):
- SAND2004-5052C
- Country of Publication:
- United States
- Language:
- English
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