Void-Free Copper Electrodeposition in Full Wafer Thickness Through-Silicon Vias with 10:1 Aspect Ratios.
Conference
·
OSTI ID:1643031
- SNL
Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1643031
- Report Number(s):
- SAND2019-13111C; 680854
- Country of Publication:
- United States
- Language:
- English
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