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Multiple wavelength photolithography for preparing multilayer microstructures

Patent ·
OSTI ID:958120
 [1];  [1]
  1. Livermore, CA
+ Show Author Affiliations

The invention relates to a multilayer microstructure and a method for preparing thereof. The method involves first applying a first photodefinable composition having a first exposure wavelength on a substrate to form a first polymeric layer. A portion of the first photodefinable composition is then exposed to electromagnetic radiation of the first exposure wavelength to form a first pattern in the first polymeric layer. After exposing the first polymeric layer, a second photodefinable composition having a second exposure wavelength is applied on the first polymeric layer to form a second polymeric layer. A portion of the second photodefinable composition is then exposed to electromagnetic radiation of the second exposure wavelength to form a second pattern in the second polymeric layer. In addition, a portion of each layer is removed according to the patterns to form a multilayer microstructure having a cavity having a shape that corresponds to the portions removed.

Research Organization:
Sandia National Laboratories (SNL-CA), Livermore, CA
Sponsoring Organization:
United States Department of Energy
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Livermore, CA)
Patent Number(s):
6,582,890
Application Number:
09/799,744
OSTI ID:
958120
Country of Publication:
United States
Language:
English

References (4)

Galvanoplated 3D structures for micro systems journal January 1994
UV-LIGA: a promising and low-cost variant for microsystem technology
  • Qu, Wenmin; Wenzel, C.; Jahn, A.
  • Conference on Optoelectronic and Microelectronic Materials and Devices - COMMAD'98, 1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140) https://doi.org/10.1109/COMMAD.1998.791668
conference January 1999
Characterization of ultrathick photoresists for MEMS applications using a 1X stepper conference September 1998
Advanced resist processing for thick photoresist applications journal January 1996

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