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Stress evolution during electrodeposition of Ni thin films.

Conference ·
OSTI ID:957235
 [1];  [1]; ; ; ;
  1. University of New Mexico, Albuquerque NM
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No abstract prepared.

Research Organization:
Sandia National Laboratories
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
OSTI ID:
957235
Report Number(s):
SAND2004-2485C
Country of Publication:
United States
Language:
English

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Related Subjects

36 MATERIALS SCIENCE
ELECTRODEPOSITION
NICKEL
STRESSES
THIN FILMS