Mold heating and cooling microprocessor conversion. Final report
Conversion of the microprocessors and software for the Mold Heating and Cooling (MHAC) pump package control systems was initiated to allow required system enhancements and provide data communications capabilities with the Plastics Information and Control System (PICS). The existing microprocessor-based control systems for the pump packages use an Intel 8088-based microprocessor board with a maximum of 64 Kbytes of program memory. The requirements for the system conversion were developed, and hardware has been selected to allow maximum reuse of existing hardware and software while providing the required additional capabilities and capacity. The new hardware will incorporate an Intel 80286-based microprocessor board with an 80287 math coprocessor, the system includes additional memory, I/O, and RS232 communication ports.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 95354
- Report Number(s):
- KCP--613-5516; ON: DE95015450
- Country of Publication:
- United States
- Language:
- English
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