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Title: Microfluidic structures and methods for integrating a functional component into a microfluidic device

Abstract

Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate which may include microchannels or other features.

Inventors:
 [1];  [2];  [3];  [4];  [5]
  1. San Francisco, CA
  2. Danville, CA
  3. San Gabriet, CA
  4. Livermore, CA
  5. Tracy, CA
Publication Date:
Research Org.:
Sandia National Laboratories (SNL-CA), Livermore, CA
Sponsoring Org.:
USDOE
OSTI Identifier:
936227
Patent Number(s):
7,351,380
Application Number:
10/754,286
Assignee:
Sandia Corporation (Livermore, CA) ALO
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Simmons, Blake, Domeier, Linda, Woo, Noble, Shepodd, Timothy, and Renzi, Ronald F. Microfluidic structures and methods for integrating a functional component into a microfluidic device. United States: N. p., 2008. Web.
Simmons, Blake, Domeier, Linda, Woo, Noble, Shepodd, Timothy, & Renzi, Ronald F. Microfluidic structures and methods for integrating a functional component into a microfluidic device. United States.
Simmons, Blake, Domeier, Linda, Woo, Noble, Shepodd, Timothy, and Renzi, Ronald F. Tue . "Microfluidic structures and methods for integrating a functional component into a microfluidic device". United States. https://www.osti.gov/servlets/purl/936227.
@article{osti_936227,
title = {Microfluidic structures and methods for integrating a functional component into a microfluidic device},
author = {Simmons, Blake and Domeier, Linda and Woo, Noble and Shepodd, Timothy and Renzi, Ronald F},
abstractNote = {Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate which may include microchannels or other features.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2008},
month = {4}
}

Patent:

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