Conductive inks for metalization in integrated polymer microsystems
Patent
·
OSTI ID:908589
- Livermore, CA
- Pleasanton, CA
- Tracy, CA
- San Antonio, TX
A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Number(s):
- 7,005,179
- OSTI ID:
- 908589
- Country of Publication:
- United States
- Language:
- English
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