Yield strength and stress relaxation data for an adhesive used in butt joint tests
Conference
·
OSTI ID:90409
Mechanical property data are reported for Epon 828/T403, an amine-cured epoxy adhesive. Data include compression modulus, compression yield strength and compression stress relaxation as a function of stress level, strain rate, and temperature and Mode I fracture toughness as a function of temperature. This data was generated to support a study investigating how temperature effects joint strength and the corresponding interface comer fracture toughness for adhesively bonded butt joints.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 90409
- Report Number(s):
- SAND--95-0869C; CONF-951033--1; ON: DE95013866
- Country of Publication:
- United States
- Language:
- English
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