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[Structure and electronic properties of defects at nonlattice matched III-V semiconductor interfaces]. Progress report, 1989--90

Technical Report ·
DOI:https://doi.org/10.2172/90071· OSTI ID:90071
Research focused on control of misfit dislocations in strained epitaxial layers of GaAs through prepatterning of the substrate. Patterning and etching trenches into GaAs substrates before epitaxial growth results in nonplanar wafer surface, which makes device fabrication more difficult. Selective ion damaging the substrate prior to growth was investigated. The question of whether the overlayer must or must not be discontinuous was addressed. The third research direction was to extend results from molecular beam epitaxially grown material to organometallic chemical vapor deposition. Effort was increased to study the patterning processes and the damage it introduces into the substrate. The research program was initiated after the discovery that 500-eV dry etching in GaAs damages the substrate much deeper than the ion range.
Research Organization:
Cornell Univ., Ithaca, NY (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
FG02-86ER45278
OSTI ID:
90071
Report Number(s):
DOE/ER/45278--4; ON: DE95013303
Country of Publication:
United States
Language:
English