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Title: Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying

Abstract

No abstract prepared.

Authors:
; ; ;
Publication Date:
Research Org.:
Ames Laboratory (AMES), Ames, IA
Sponsoring Org.:
USDOE Office of Science and Technology (OST) - (EM-50)
OSTI Identifier:
889497
Report Number(s):
IS-J 6826
Journal ID: ISSN 0361-5235; JECMA5; TRN: US200619%%497
DOE Contract Number:  
W-7405-Eng-82
Resource Type:
Journal Article
Journal Name:
Journal of Electronic Materials
Additional Journal Information:
Journal Volume: 31; Journal Issue: 11; Journal ID: ISSN 0361-5235
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; MORPHOLOGICAL CHANGES; MICROSTRUCTURE; SOLDERED JOINTS; METALLURGICAL FLUX; TIN; SILVER; COPPER

Citation Formats

Anderson, I E, Cook, B A, Harringa, J, and Terpstra, R L. Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying. United States: N. p., 2002. Web. doi:10.1007/s11664-002-0006-x.
Anderson, I E, Cook, B A, Harringa, J, & Terpstra, R L. Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying. United States. doi:10.1007/s11664-002-0006-x.
Anderson, I E, Cook, B A, Harringa, J, and Terpstra, R L. Mon . "Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying". United States. doi:10.1007/s11664-002-0006-x.
@article{osti_889497,
title = {Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying},
author = {Anderson, I E and Cook, B A and Harringa, J and Terpstra, R L},
abstractNote = {No abstract prepared.},
doi = {10.1007/s11664-002-0006-x},
journal = {Journal of Electronic Materials},
issn = {0361-5235},
number = 11,
volume = 31,
place = {United States},
year = {2002},
month = {7}
}