Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying
Journal Article
·
· Journal of Electronic Materials
No abstract prepared.
- Research Organization:
- Ames Lab., Ames, IA (United States)
- Sponsoring Organization:
- USDOE Office of Science and Technology (OST) - (EM-50)
- DOE Contract Number:
- W-7405-Eng-82
- OSTI ID:
- 889497
- Report Number(s):
- IS-J 6826; JECMA5; TRN: US200619%%497
- Journal Information:
- Journal of Electronic Materials, Vol. 31, Issue 11; ISSN 0361-5235
- Country of Publication:
- United States
- Language:
- English
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