Recent Advances in Electron Tomography: TEM and HAADF-STEM Tomography for Materials Science and IC Applications

Kubel, C; Voigt, A; Schoenmakers, R; Otten, M; Su, D; Lee, T; Carlsson, A; Engelmann, H; Bradley, J

doi:10.1017/S1431927605050361

Recent Advances in Electron Tomography: TEM and HAADF-STEM Tomography for Materials Science and IC Applications

Journal Article · Wed Nov 09 04:00:00 EST 2005 · Microscopy and Microanalysis

DOI:https://doi.org/10.1017/S1431927605050361· OSTI ID:888597

Kubel, C; Voigt, A; Schoenmakers, R; Otten, M; Su, D; Lee, T; Carlsson, A; Engelmann, H; Bradley, J

Electron tomograph tomography is a well y well-established technique for three-dimensional structure determination of (almost) amorphous specimens in life science applications. With the recent advances in nanotechnology and the semiconductor industry, there is also an increasing need for high-resolution 3D structural information in physical sciences. In this paper, we evaluate the capabilities and limitations of TEM and HAADF-STEM tomography for the 3D structural characterization of partially crystalline to highly crystalline materials. Our analysis of catalysts, a hydrogen storage material, and different semiconductor devices shows that features with a diameter as small as 1-2 nm can be resolved in 3D by electron tomography. For partially crystalline materials with small single crystalline domains, TEM tomography provides reliable 3D structural information. HAADF-STEM tomography is more versatile and can also be used for high-resolution 3D imaging of highly crystalline materials such as semiconductor devices.

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Research Organization:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA

Sponsoring Organization:: USDOE

DOE Contract Number:: W-7405-ENG-48

OSTI ID:: 888597

Report Number(s):: UCRL-JRNL-217035

Journal Information:: Microscopy and Microanalysis, Journal Name: Microscopy and Microanalysis Journal Issue: 5 Vol. 11; ISSN 1431-9276; ISSN MIMIF7

Country of Publication:: United States

Language:: English

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