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High Spatial Resolution Stress Measurements using Synchrotronbased Scanning X-Ray Microdiffraction with White or Monochromaticbeam

Journal Article · · Materials Science & Engineering A

Scanning X-ray microdiffraction (mu SXRD) combines the use of high brilliance synchrotron sources with state-of-the-art achromatic X-ray focusing optics and large area detector technology. Using either white or monochromatic beams, it allows for orientation and strain/stress mapping of polycrystalline thin films with submicron spatial resolution.The present paper will focus on three applications performed at the Advanced Light Source: the study of local plasticity in aluminum thin films, the study of the spontaneous growth of tin whiskers in lead-free solder finish and the measurement of strain field around thin film bucklings.

Research Organization:
Ernest Orlando Lawrence Berkeley NationalLaboratory, Berkeley, CA (US)
Sponsoring Organization:
USDOE Director. Office of Science. Office of Basic EnergySciences. Materials Science and Engineering Division
DOE Contract Number:
AC02-05CH11231
OSTI ID:
883780
Report Number(s):
LBNL--58978; BnR: KC0204016
Journal Information:
Materials Science & Engineering A, Journal Name: Materials Science & Engineering A Vol. 399
Country of Publication:
United States
Language:
English