Method Of Packaging And Assembling Electro-Microfluidic Devices

Patent · Mon Nov 22 23:00:00 EST 2004

OSTI ID:879946

Benavides, Gilbert L ^[1]; Galambos, Paul C ^[1]; Emerson, John A ^[1]; Peterson, Kenneth A ^[1]; Giunta, Rachel K ^[1]; Zamora, David Lee ^[1]; Watson, Robert D ^[2]

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1. Albuquerque, NM
2. Tijeras, NM

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

• Research Organization: Sandia Corporation
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, MN)
• Patent Number(s): US 6821819
• Application Number: 10/370543
• OSTI ID: 879946
• Country of Publication: United States
• Language: English