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Packaging of electro-microfluidic devices

Patent ·
OSTI ID:874697
 [1];  [1];  [1];  [1];  [1];  [2]
  1. Albuquerque, NM
  2. Tijeras, NM
+ Show Author Affiliations

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Research Organization:
SANDIA CORP
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 6443179
OSTI ID:
874697
Country of Publication:
United States
Language:
English

References (7)

Electroplated electro-fluidic interconnects for chemical sensors journal August 2000
Electrical and fluidic packaging of surface micromachined electromicrofluidic devices conference August 2000
Low-cost plastic sensor packaging using the open-window package concept journal May 1998
Fluidic interconnects for modular assembly of chemical microsystems journal June 1998
An integrated liquid mixer/valve journal September 2000
A new technology for fluidic microsystems based on PCB technology journal October 1999
A highly flexible design and production framework for modularized microelectromechanical systems journal March 1999

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Related Subjects

/137/285/
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