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Title: Assembly of opto-electronic module with improved heat sink

Patent ·
OSTI ID:879857
 [1];  [2];  [3];  [4];  [5];  [6];  [7];  [8];  [7]
  1. Vestal, NY
  2. Richelieu, CA
  3. Rochester, MN
  4. Binghampton, NY
  5. Stukely-sud, CA
  6. Yorktown Heights, NY
  7. Granby, CA
  8. Lisle, NY
+ Show Author Affiliations

A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
DOE Contract Number:
W-7405-ENG-48
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
US 6,822,875
Application Number:
10/281036
OSTI ID:
879857
Country of Publication:
United States
Language:
English

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conference January 1996
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conference January 1997

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